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Vertical 3D memory technologies

Author: Betty Prince
Publisher: Chichester, West Sussex, United Kingdom : Wiley, 2014.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

The large scale integration and planar scaling of individual system chips is reaching an expensive limit.

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Additional Physical Format: Online version:
Prince, Betty.
Vertical 3D memory technologies.
Chichester, West Sussex, United Kingdom : Wiley, [2014]
(DLC) 2014023305
(OCoLC)881418298
Document Type: Book
All Authors / Contributors: Betty Prince
ISBN: 9781118760512 1118760514
OCLC Number: 881205810
Description: xiii, 351 pages ; 26 cm
Contents: Basic memory device trends toward the vertical --
3D memory using double-gate, folded, TFT, and stacked crystal silicon --
Gate-all around (GAA) nanowire for vertical memory --
Vertical NAND flash --
3D cross-point array memory --
3D stacking of RAM-processor chips using TSV.
Other Titles: Vertical three dimensional memory technologies
Responsibility: Betty Prince.

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In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies. (3dincites.com, 30 September 2014) "As the semiconductor Read more...

 
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