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VLSI-SoC: Internet of Things Foundations : 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, revised selected papers

Author: Luc J M Claesen; Maria-Teresa Sanz-Pascual; Ricardo Reis; Arturo Sarmiento-Reyes
Publisher: Cham : Springer, 2015.
Series: IFIP advances in information and communication technology, 464.
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:
This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and  Read more...
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Printed edition:
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Luc J M Claesen; Maria-Teresa Sanz-Pascual; Ricardo Reis; Arturo Sarmiento-Reyes
ISBN: 9783319252797 3319252798
OCLC Number: 932169742
Description: 1 online resource (xiv, 241 pages) : illustrations.
Series Title: IFIP advances in information and communication technology, 464.
Responsibility: edited by Luc Claesen, Maria-Teresa Sanz-Pascual, Ricardo Reis, Arturo Sarmiento-Reyes.
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Abstract:

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

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