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VLSI-SoC: Technologies for Systems Integration : 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-14, 2009, revised selected papers

Author: Jürgen Becker; Marcelo De Oliveira Johann; Ricardo Reis
Publisher: Heidelberg ; New York : Springer, ©2011.
Series: IFIP advances in information and communication technology, 360.
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of  Read more...
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Genre/Form: Electronic books
Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Jürgen Becker; Marcelo De Oliveira Johann; Ricardo Reis
ISBN: 9783642231209 3642231209
OCLC Number: 755715017
Description: 1 online resource (viii, 197 pages) : illustrations (some color).
Series Title: IFIP advances in information and communication technology, 360.
Other Titles: VLSI-SoC 2009
Responsibility: Jürgen Becker, Marcelo Johann, Ricardo Reis (eds.).

Abstract:

This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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