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A wafer chuck for use between -196 and 350°C

Author: R Y Koyama; Martin G Buehler; United States. Division of Electric Energy Systems.; United States. Defense Advanced Research Projects Agency.
Publisher: Washington : U.S. Dept. of Commerce, National Bureau of Standards : For sale by the Supt. of Docs., U.S. Govt. Print. Off., 1979.
Series: Semiconductor measurement technology.; NBS special publication, 400-55.
Edition/Format:   Print book : National government publication : EnglishView all editions and formats
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Additional Physical Format: Online version:
Koyama, R.Y.
Wafer chuck for use between -196 and 350°C.
Washington : U.S. Dept. of Commerce, National Bureau of Standards : For sale by the Supt. of Docs., U.S. Govt. Print. Off., 1979
(OCoLC)633088054
Material Type: Government publication, National government publication
Document Type: Book
All Authors / Contributors: R Y Koyama; Martin G Buehler; United States. Division of Electric Energy Systems.; United States. Defense Advanced Research Projects Agency.
OCLC Number: 5561858
Notes: "Sponsored by Division of Electric Energy Systems, Department of Energy and the Defense Advanced Research Projects Agency."
Description: vi, 17 pages : illustrations ; 26 cm.
Series Title: Semiconductor measurement technology.; NBS special publication, 400-55.
Responsibility: R.Y. Koyama and M.G. Buehler.

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