Front cover image for Syntheses, crystal structures, thermal and magnetic properties of new heterotrinuclear CuII-LnIII-CuII complexes incorporating N2O4-donor Schiff base ligands

Peer-reviewed

Syntheses, crystal structures, thermal and magnetic properties of new heterotrinuclear CuII-LnIII-CuII complexes incorporating N2O4-donor Schiff base ligands

Graphical abstract: The new heterotrinuclear Cu II -Ln III -Cu II complexes were synthesised. The main differences between them originate in the nature of the polynuclear species (cationic versus neutral), the kind and amount of solvent molecules in the outer coordination sphere and the type of ligands coordinated to copper(II) ions. They are stable at room temperature and their decomposition processes proceed in the similar way. The temperature dependence of the magnetic susceptibility and the field-dependent magnetization indicated that the interaction between Cu II and Ln III ions (Ln=Pr and Nd) is antiferromagnetic. Abstract: New heterotrinuclear complexes [Cu2 La(H2 hamp)2 (NO3)2 H2 O]NO3 ·6MeOH (1), [Cu2 Pr(H2 hamp)2 (NO3)3]·6MeOH (2), [Cu2 Nd(H2 hamp)2 (NO3)(MeOH)2](NO3)2 ·H2 O (3) where H2 hamp is the dideprotonated forms of the N, N2 -bis(2, 3-dihydroxybenzylidene)-1, 3-diamino-2, 2-dimethylpropane were obtained in the reaction of the Schiff base ligand with the respective salts of Cu II and Ln III . The compounds1 -3 crystallize in the monoclinic space group P 21 / n . The X-ray structures of1 -3 show the central Ln III ion surrounded by two CuH2 hamp units, so that Ln III and Cu II ions are linked by phenoxido bridging groups. The compounds1 -3 are stable at room temperature and their decomposition processes proceed in the similar way. The temperature dependence of the magnetic susceptibility and the field-dependent magnetization indicated that the interaction between Cu II and Ln III ions (Ln=Pr and Nd) is antiferromagnetic
Downloadable Article, English, 2018
Elsevier, Amsterdam, 2018
Polyhedron
1 online resource
0277-5387
1051344298
In: Polyhedron, Vol. 144, no. (2018), p.225-233
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