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10th IEEE Workshop on Signal Propagation on Interconnects : proceedings : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany

Author: Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society. Technical Council on Test Technology.
Publisher: Piscataway, N.J. : IEEE, ©2006.
Edition/Format:   eBook : Document : Conference publication : English
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Genre/Form: Electronic book
Conference papers and proceedings
Congresses
Additional Physical Format: Print version:
IEEE Workshop on Signal Propagation on Interconnects (10th : 2006 : Berlin, Germany).
10th IEEE Workshop on Signal Propagation on Interconnects.
Piscataway, N.J. : IEEE, ©2006
(DLC) 2007272796
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society. Technical Council on Test Technology.
ISBN: 142440455X 9781424404551
OCLC Number: 133003191
Language Note: English.
Notes: "IEEE Cat No: 06EX1412."
Description: 1 online resource (289 pages) : illustrations (some color)
Other Titles: Signal Propagation on Interconnects, 2006, IEEE Workshop on.
IEEE Workshop on Signal Propagation on Interconnects
SPI 2006
Responsibility: co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) and by IEEE Computer Society, Test Technology Technical Council (TTTC).

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