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2017 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) : Austin, TX, June 17, 2017

Author: Tsung-Yi Ho; Shiyan Hu; Mustafa Badaroglu; Institute of Electrical and Electronics Engineers,; Association for Computing Machinery.
Publisher: Piscataway, N.J. : IEEE, [2017] ©2017
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Tsung-Yi Ho; Shiyan Hu; Mustafa Badaroglu; Institute of Electrical and Electronics Engineers,; Association for Computing Machinery.
OCLC Number: 1001463556
Notes: "IEEE Catalog Numbers: CFP17SLP-ART."
Description: 1 online resource : illustrations
Other Titles: SLIP 2017
19th ACM/IEEE International Workshop on System Level Interconnect Prediction
SLIP '17
System Level Interconnect Prediction (SLIP), 2017 ACM/IEEE International Workshop on
Responsibility: general chair: Tsung-Yi Ho, National Tsing Hua University, Taiwan ; program chairs: Shiyan Hu, Michigan Technological University, USA, Mustafa Badaroglu, Qualcomm Inc., USA.

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