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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) : Haining, Zhejiang, China, Dec. 14-16, 2017.

Author: Components, Packaging & Manufacturing Technology Society,; Institute of Electrical and Electronics Engineers,
Publisher: Piscataway, NJ : IEEE, [2017?] ©2017
Edition/Format:   eBook : Document : Conference publication : English
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Components, Packaging & Manufacturing Technology Society,; Institute of Electrical and Electronics Engineers,
ISBN: 9781538612385 1538612380
OCLC Number: 1028664318
Notes: "Part Number: CFP17EDP-ART."
Description: 1 online resource (various pagings) : illustrations
Other Titles: EDAPS 2017

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