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2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) : proceedings of technical papers : Toyama, Japan, February 28 - March 2, 2017

Author: IEEE Electron Devices Society,; JTB Communication Design (Firm),; Institute of Electrical and Electronics Engineers.
Publisher: Tokyo, Japan : JTB Communication Design, Inc., [2017?] ©2017
Edition/Format:   eBook : Document : Conference publication : English
Summary:
Asia has strong potential to take the initiative for system integration Deep dive discussions among industry experts on materials, processes and devices are essential to accelerate manufacturing innovations through this forum The first conference in 2017 focuses on devices, tools, materials for IoT Packaging and Manufacturing Technology are also discussed.
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: IEEE Electron Devices Society,; JTB Communication Design (Firm),; Institute of Electrical and Electronics Engineers.
OCLC Number: 1007336714
Notes: "IEEE Part No. CFP17J58-USB."
Description: 1 online resource (various pagings) : illustrations
Other Titles: EDTM 2017
Responsibility: organized by IEEE Electron Devices Society.

Abstract:

Asia has strong potential to take the initiative for system integration Deep dive discussions among industry experts on materials, processes and devices are essential to accelerate manufacturing innovations through this forum The first conference in 2017 focuses on devices, tools, materials for IoT Packaging and Manufacturing Technology are also discussed.

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