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24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) : 4 July 7 - July 2017, Chengdu, China.

Author: IEEE Electron Devices Society,; IEEE Reliability Society,; Institute of Electrical and Electronics Engineers,
Publisher: [Piscataway, New Jersey] : IEEE, [2017?]
Edition/Format:   eBook : Document : Conference publication : English
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: IEEE Electron Devices Society,; IEEE Reliability Society,; Institute of Electrical and Electronics Engineers,
OCLC Number: 1012474542
Notes: "IEEE Catalog Number:CFP17777."
Description: 1 online resource (various pagings) : illustrations
Other Titles: IPFA 2017
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Primary Entity

<http://www.worldcat.org/oclc/1012474542> # 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) : 4 July 7 - July 2017, Chengdu, China.
    a schema:MediaObject, schema:CreativeWork, schema:Book ;
    library:oclcnum "1012474542" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nju> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/4620064270#Topic/semiconductors_failures> ; # Semiconductors--Failures
    schema:about <http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_defects> ; # Integrated circuits--Defects
    schema:about <http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_reliability> ; # Integrated circuits--Reliability
    schema:about <http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_testing> ; # Integrated circuits--Testing
    schema:alternateName "2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)" ;
    schema:alternateName "IPFA 2017" ;
    schema:bookFormat schema:EBook ;
    schema:contributor <http://experiment.worldcat.org/entity/work/data/4620064270#Organization/ieee_reliability_society> ; # IEEE Reliability Society,
    schema:contributor <http://experiment.worldcat.org/entity/work/data/4620064270#Organization/institute_of_electrical_and_electronics_engineers> ; # Institute of Electrical and Electronics Engineers,
    schema:contributor <http://experiment.worldcat.org/entity/work/data/4620064270#Organization/ieee_electron_devices_society> ; # IEEE Electron Devices Society,
    schema:creator <http://experiment.worldcat.org/entity/work/data/4620064270#Meeting/international_symposium_on_the_physical_&_failure_analysis_of_integrated_circuits_24th_2017_chengdu_china> ; # International Symposium on the Physical & Failure Analysis of Integrated Circuits (24th : 2017 : Chengdu, China)
    schema:datePublished "2017" ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/4620064270> ;
    schema:genre "Conference publication"@en ;
    schema:genre "Conference papers and proceedings"@en ;
    schema:inLanguage "en" ;
    schema:name "24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) : 4 July 7 - July 2017, Chengdu, China."@en ;
    schema:productID "1012474542" ;
    schema:url <http://liverpool.idm.oclc.org/login?url=https://ieeexplore.ieee.org/servlet/opac?punumber=8052582> ;
    schema:url <http://ieeexplore.ieee.org/servlet/opac?punumber=8052582> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/1012474542> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/4620064270#Meeting/international_symposium_on_the_physical_&_failure_analysis_of_integrated_circuits_24th_2017_chengdu_china> # International Symposium on the Physical & Failure Analysis of Integrated Circuits (24th : 2017 : Chengdu, China)
    a bgn:Meeting, schema:Event ;
    schema:location <http://experiment.worldcat.org/entity/work/data/4620064270#Place/chengdu_china> ; # Chengdu, China)
    schema:name "International Symposium on the Physical & Failure Analysis of Integrated Circuits (24th : 2017 : Chengdu, China)" ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Organization/ieee_electron_devices_society> # IEEE Electron Devices Society,
    a schema:Organization ;
    schema:name "IEEE Electron Devices Society," ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Organization/ieee_reliability_society> # IEEE Reliability Society,
    a schema:Organization ;
    schema:name "IEEE Reliability Society," ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Organization/institute_of_electrical_and_electronics_engineers> # Institute of Electrical and Electronics Engineers,
    a schema:Organization ;
    schema:name "Institute of Electrical and Electronics Engineers," ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Place/chengdu_china> # Chengdu, China)
    a schema:Place ;
    schema:name "Chengdu, China)" ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_defects> # Integrated circuits--Defects
    a schema:Intangible ;
    schema:name "Integrated circuits--Defects"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_reliability> # Integrated circuits--Reliability
    a schema:Intangible ;
    schema:name "Integrated circuits--Reliability"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Topic/integrated_circuits_testing> # Integrated circuits--Testing
    a schema:Intangible ;
    schema:name "Integrated circuits--Testing"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4620064270#Topic/semiconductors_failures> # Semiconductors--Failures
    a schema:Intangible ;
    schema:name "Semiconductors--Failures"@en ;
    .

<http://www.worldcat.org/title/-/oclc/1012474542>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/1012474542> ; # 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) : 4 July 7 - July 2017, Chengdu, China.
    schema:dateModified "2019-02-09" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


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