The Entrepreneur's Guide to Preparing a Winning Business Plan and Raising Venture Capital

1. SPICE Modeling and the Dominance of CMOS Technology. 2. SPICE Modeling and the Formalism of Model Building. 3. The Semiconductor Physics of MOS Structures. 4. A Comparison of Analytical and Numerical Results. 5. The Level 1 Model. 6. The Level 2 Model. 7. The Level 3 Model. 8. BSIM. 9. HSPICE Level 28. 10. BSIM2. 11. BSIM3. 12. MOS Model 9. 13. The Active Device Capacitance. 14. Accounting for Systematic Process Variations. 15. Circuit Level Correlation of Models and Hardware. 16. New Model Candidates. 17. The Future of Device Models for Circuit Simulation. APPENDICES. A. An Executive Summary of the Various Models. B. Channel Length and Width. C. The Final Model Equations. D. The Extracted HSPICE Level 28 Model. E. The Binned BSIM2 Model. INDEX.