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Advances in electronic circuit packaging; proceedings.

Author: Lawrence L Rosine; University of Colorado (Boulder campus)
Publisher: [Englewood, Colo.] Cahners Pub. Co.; distributed by Plenum Press, New York, 1965.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Lawrence L Rosine; University of Colorado (Boulder campus)
OCLC Number: 1164822
Notes: "Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."
Description: vi, 297 pages illustrations 26 cm
Other Titles: Electrical design news.
Design news.
Responsibility: Edited by Lawrence L. Rosine.

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Primary Entity<\/h3>
<http:\/\/www.worldcat.org\/oclc\/1164822<\/a>> # Advances in electronic circuit packaging; proceedings.<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Book<\/a>, schema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0library:oclcnum<\/a> \"1164822<\/span>\" ;\u00A0\u00A0\u00A0library:placeOfPublication<\/a> <http:\/\/id.loc.gov\/vocabulary\/countries\/cou<\/a>> ;\u00A0\u00A0\u00A0library:placeOfPublication<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Place\/englewood_colo<\/a>> ; # Englewood, Colo.<\/span>\u00A0\u00A0\u00A0rdfs:seeAlso<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#CreativeWork\/electrical_design_news<\/a>> ; # Electrical design news.<\/span>\u00A0\u00A0\u00A0rdfs:seeAlso<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#CreativeWork\/design_news<\/a>> ; # Design news.<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/id.worldcat.org\/fast\/907414<\/a>> ; # Electronic packaging<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/encapsulation_electronique_congres<\/a>> ; # Encapsulation (\u00E9lectronique)--Congr\u00E8s<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/electronic_packaging<\/a>> ; # Electronic packaging<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/mise_sous_boitier_electronique_congres<\/a>> ; # Mise sous bo\u00EEtier (\u00E9lectronique)--Congr\u00E8s<\/span>\u00A0\u00A0\u00A0schema:bookFormat<\/a> bgn:PrintBook<\/a> ;\u00A0\u00A0\u00A0schema:contributor<\/a> <http:\/\/viaf.org\/viaf\/133657124<\/a>> ; # University of Colorado (Boulder campus)<\/span>\u00A0\u00A0\u00A0schema:creator<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Meeting\/international_electronic_circuit_packaging_symposium_5th_1964_boulder_colo<\/a>> ; # International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)<\/span>\u00A0\u00A0\u00A0schema:datePublished<\/a> \"1965<\/span>\" ;\u00A0\u00A0\u00A0schema:editor<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Person\/rosine_lawrence_l<\/a>> ; # Lawrence L. Rosine<\/span>\u00A0\u00A0\u00A0schema:exampleOfWork<\/a> <http:\/\/worldcat.org\/entity\/work\/id\/2101573<\/a>> ;\u00A0\u00A0\u00A0schema:genre<\/a> \"Conference papers and proceedings<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0schema:genre<\/a> \"Conference publication<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0schema:inLanguage<\/a> \"en<\/span>\" ;\u00A0\u00A0\u00A0schema:name<\/a> \"Advances in electronic circuit packaging; proceedings.<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0schema:productID<\/a> \"1164822<\/span>\" ;\u00A0\u00A0\u00A0schema:publication<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/1164822#PublicationEvent\/englewood_colo_cahners_pub_co_distributed_by_plenum_press_new_york_1965<\/a>> ;\u00A0\u00A0\u00A0schema:publisher<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Agent\/cahners_pub_co_distributed_by_plenum_press_new_york<\/a>> ; # Cahners Pub. Co.; distributed by Plenum Press, New York<\/span>\u00A0\u00A0\u00A0wdrs:describedby<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/1164822<\/a>> ;\u00A0\u00A0\u00A0\u00A0.<\/div>

Related Entities<\/h3>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Agent\/cahners_pub_co_distributed_by_plenum_press_new_york<\/a>> # Cahners Pub. Co.; distributed by Plenum Press, New York<\/span>\u00A0\u00A0\u00A0\u00A0a bgn:Agent<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Cahners Pub. Co.; distributed by Plenum Press, New York<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#CreativeWork\/design_news<\/a>> # Design news.<\/span>\u00A0\u00A0\u00A0\u00A0a schema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Design news.<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#CreativeWork\/electrical_design_news<\/a>> # Electrical design news.<\/span>\u00A0\u00A0\u00A0\u00A0a schema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Electrical design news.<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Meeting\/international_electronic_circuit_packaging_symposium_5th_1964_boulder_colo<\/a>> # International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)<\/span>\u00A0\u00A0\u00A0\u00A0a bgn:Meeting<\/a>, schema:Event<\/a> ;\u00A0\u00A0\u00A0schema:location<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Place\/boulder_colo<\/a>> ; # Boulder, Colo.)<\/span>\u00A0\u00A0\u00A0schema:name<\/a> \"International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Person\/rosine_lawrence_l<\/a>> # Lawrence L. Rosine<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Person<\/a> ;\u00A0\u00A0\u00A0schema:familyName<\/a> \"Rosine<\/span>\" ;\u00A0\u00A0\u00A0schema:givenName<\/a> \"Lawrence L.<\/span>\" ;\u00A0\u00A0\u00A0schema:name<\/a> \"Lawrence L. Rosine<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Place\/boulder_colo<\/a>> # Boulder, Colo.)<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Place<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Boulder, Colo.)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Place\/englewood_colo<\/a>> # Englewood, Colo.<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Place<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Englewood, Colo.<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/electronic_packaging<\/a>> # Electronic packaging<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0rdfs:seeAlso<\/a> <http:\/\/id.loc.gov\/authorities\/subjects\/sh2008102949<\/a>> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Electronic packaging<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/encapsulation_electronique_congres<\/a>> # Encapsulation (\u00E9lectronique)--Congr\u00E8s<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Encapsulation (\u00E9lectronique)--Congr\u00E8s<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Topic\/mise_sous_boitier_electronique_congres<\/a>> # Mise sous bo\u00EEtier (\u00E9lectronique)--Congr\u00E8s<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Mise sous bo\u00EEtier (\u00E9lectronique)--Congr\u00E8s<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.loc.gov\/vocabulary\/countries\/cou<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:Place<\/a> ;\u00A0\u00A0\u00A0dcterms:identifier<\/a> \"cou<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.worldcat.org\/fast\/907414<\/a>> # Electronic packaging<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Electronic packaging<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/viaf.org\/viaf\/133657124<\/a>> # University of Colorado (Boulder campus)<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Organization<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"University of Colorado (Boulder campus)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/www.worldcat.org\/title\/-\/oclc\/1164822<\/a>>\u00A0\u00A0\u00A0\u00A0a genont:InformationResource<\/a>, genont:ContentTypeGenericResource<\/a> ;\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/www.worldcat.org\/oclc\/1164822<\/a>> ; # Advances in electronic circuit packaging; proceedings.<\/span>\u00A0\u00A0\u00A0schema:dateModified<\/a> \"2018-11-11<\/span>\" ;\u00A0\u00A0\u00A0void:inDataset<\/a> <http:\/\/purl.oclc.org\/dataset\/WorldCat<\/a>> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/www.worldcat.org\/title\/-\/oclc\/1164822#PublicationEvent\/englewood_colo_cahners_pub_co_distributed_by_plenum_press_new_york_1965<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:PublicationEvent<\/a> ;\u00A0\u00A0\u00A0schema:location<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Place\/englewood_colo<\/a>> ; # Englewood, Colo.<\/span>\u00A0\u00A0\u00A0schema:organizer<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/2101573#Agent\/cahners_pub_co_distributed_by_plenum_press_new_york<\/a>> ; # Cahners Pub. Co.; distributed by Plenum Press, New York<\/span>\u00A0\u00A0\u00A0schema:startDate<\/a> \"1965<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>

Content-negotiable representations<\/p>