skip to content
Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium Preview this item
ClosePreview this item
Checking...

Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium

Author: Lawrence L Rosine; University of Colorado (Boulder campus)
Publisher: New York : Springer Science + Business Media, 1963.
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy online

Links to this item

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Electronic books
Conference papers and proceedings
Congresses
Additional Physical Format: Print version:
International Electronic Circuit Packaging Symposium (3rd : 1962 : Boulder, Colo.).
Advances in electronic circuit packaging
(DLC) 72187720
(OCoLC)1164824
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Lawrence L Rosine; University of Colorado (Boulder campus)
ISBN: 9781489973092 1489973095
OCLC Number: 890933111
Notes: "Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."
Description: 1 online resource (vi, 457 pages) : illustrations
Other Titles: Electrical design news.
Design news.
Responsibility: edited by Lawrence L. Rosine.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/890933111> # Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium
    a schema:CreativeWork, schema:Book, schema:MediaObject ;
   library:oclcnum "890933111" ;
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/cou> ;
   rdfs:seeAlso <http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/design_news> ; # Design news.
   rdfs:seeAlso <http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/electrical_design_news> ; # Electrical design news.
   schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/electronic_packaging> ; # Electronic packaging
   schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/encapsulation_electronique_congres> ; # Encapsulation (électronique)--Congrès
   schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/mise_sous_boitier_electronique_congres> ; # Mise sous boîtier (électronique)--Congrès
   schema:about <http://dewey.info/class/621.381/e23/> ;
   schema:bookFormat schema:EBook ;
   schema:contributor <http://experiment.worldcat.org/entity/work/data/2101573#Organization/university_of_colorado_boulder_campus> ; # University of Colorado (Boulder campus)
   schema:creator <http://experiment.worldcat.org/entity/work/data/2101573#Meeting/international_electronic_circuit_packaging_symposium_3rd_1962_boulder_colo> ; # International Electronic Circuit Packaging Symposium (3rd : 1962 : Boulder, Colo.)
   schema:datePublished "1963" ;
   schema:editor <http://experiment.worldcat.org/entity/work/data/2101573#Person/rosine_lawrence_l> ; # Lawrence L. Rosine
   schema:exampleOfWork <http://worldcat.org/entity/work/id/2101573> ;
   schema:genre "Conference papers and proceedings"@en ;
   schema:genre "Electronic books"@en ;
   schema:genre "Conference publication"@en ;
   schema:inLanguage "en" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/1164824> ;
   schema:name "Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium"@en ;
   schema:productID "890933111" ;
   schema:url <http://link.springer.com/10.1007/978-1-4899-7309-2> ;
   schema:url <http://dx.doi.org/10.1007/978-1-4899-7309-2> ;
   schema:workExample <http://dx.doi.org/10.1007/978-1-4899-7309-2> ;
   schema:workExample <http://worldcat.org/isbn/9781489973092> ;
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/890933111> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/electrical_design_news> # Electrical design news.
    a schema:CreativeWork ;
   schema:name "Electrical design news." ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Meeting/international_electronic_circuit_packaging_symposium_3rd_1962_boulder_colo> # International Electronic Circuit Packaging Symposium (3rd : 1962 : Boulder, Colo.)
    a bgn:Meeting, schema:Event ;
   schema:location <http://experiment.worldcat.org/entity/work/data/2101573#Place/boulder_colo> ; # Boulder, Colo.)
   schema:name "International Electronic Circuit Packaging Symposium (3rd : 1962 : Boulder, Colo.)" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Organization/university_of_colorado_boulder_campus> # University of Colorado (Boulder campus)
    a schema:Organization ;
   schema:name "University of Colorado (Boulder campus)" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Person/rosine_lawrence_l> # Lawrence L. Rosine
    a schema:Person ;
   schema:familyName "Rosine" ;
   schema:givenName "Lawrence L." ;
   schema:name "Lawrence L. Rosine" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Place/boulder_colo> # Boulder, Colo.)
    a schema:Place ;
   schema:name "Boulder, Colo.)" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Topic/electronic_packaging> # Electronic packaging
    a schema:Intangible ;
   schema:name "Electronic packaging"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Topic/encapsulation_electronique_congres> # Encapsulation (électronique)--Congrès
    a schema:Intangible ;
   schema:name "Encapsulation (électronique)--Congrès"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Topic/mise_sous_boitier_electronique_congres> # Mise sous boîtier (électronique)--Congrès
    a schema:Intangible ;
   schema:name "Mise sous boîtier (électronique)--Congrès"@en ;
    .

<http://link.springer.com/10.1007/978-1-4899-7309-2>
   rdfs:comment "Available to Stanford-affiliated users." ;
    .

<http://worldcat.org/isbn/9781489973092>
    a schema:ProductModel ;
   schema:isbn "1489973095" ;
   schema:isbn "9781489973092" ;
    .

<http://www.worldcat.org/oclc/1164824>
    a schema:CreativeWork ;
   rdfs:label "Advances in electronic circuit packaging" ;
   schema:description "Print version:" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/890933111> ; # Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium
    .

<http://www.worldcat.org/title/-/oclc/890933111>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
   schema:about <http://www.worldcat.org/oclc/890933111> ; # Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium
   schema:dateModified "2018-11-09" ;
   void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.