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Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii Preview this item
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Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

Author: D Agonafer; M Saka; Yung-Cheng Lee; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Publisher: New York, N.Y. : American Society of Mechanical Engineers, ©1999.
Series: EEP (Series), vol. 26.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: D Agonafer; M Saka; Yung-Cheng Lee; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
ISBN: 0791816125 9780791816127
OCLC Number: 41606835
Description: 2 volumes : illustrations ; 28 cm.
Series Title: EEP (Series), vol. 26.
Other Titles: InterPACK '99
Responsibility: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.

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Primary Entity

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