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Advances in electronic packaging 1999 : proceedings of the Pacific Rim/ASME international intersociety electronic & photonic packaging conference InterPACK'99 : presented at the Pacific Rim/ASME international intersociety electronic and photonic packaging conference, June 13-19, 1999, Maui, Hawaii

Author: Dereje Agonafer; Masumi Saka; Yung-Cheng Lee
Publisher: New York : The American Society of Mechanical Engineers, 1999.
Series: EEP, 26.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Dereje Agonafer; Masumi Saka; Yung-Cheng Lee
ISBN: 0791816125 9780791816127
OCLC Number: 439794612
Description: 2 zv. (XXIV, 1082 str.; XXIV, 1083-2217 str.) : graf. prikazi ; 30 cm.
Series Title: EEP, 26.
Other Titles: InterPACK'99.
Responsibility: edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.

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