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Advances in electronic packaging : proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging

Author: American Society of Mechanical Engineers.; Nihon Kikai Gakkai.
Publisher: New York, N.Y. : American Society of Mechanical Engineers
Series: EEP (Series)
Edition/Format:   eJournal/eMagazine : Document : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Print version:
Advances in electronic packaging
(DLC)sn 99006097
(OCoLC)30949379
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File, Journal / Magazine / Newspaper
All Authors / Contributors: American Society of Mechanical Engineers.; Nihon Kikai Gakkai.
OCLC Number: 607745642
Notes: Issues for 1993- contain the proceedings of the ... ASME International Electronics Packaging Conference.
Reproduction Notes: Electronic reproduction. [Place of publication not identified] : HathiTrust Digital Library, 2010. MiAaHDL
Description: volumes : illustrations ; 28 cm
Details: Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Series Title: EEP (Series)
Responsibility: sponsored by the American Society of Mechanical [and] the Japan Society of Mechanical Engineers.

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