skip to content
Di shi ba jie dian zi feng zhuang ji shu guo ji hui yi = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China Preview this item
ClosePreview this item
Checking...

ICEPT 2018 : 第十八届电子封装技术国际会议 = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China /
Di shi ba jie dian zi feng zhuang ji shu guo ji hui yi = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China

Author: hosted by IMECAS ; technically sponsored by IEEE Electronics Packaging Society, EMPT ; organized by Fudan University ; editors, Tianchun Ye [and 3 others]. ; ; Tianchun YeInstitute of Microelectronics of Chinese Academy of Sciences,IEEE Electronics Packaging Society,Zhongguo dian zi xue hui. Electronics Manufacturing & Packaging Technology Society,All authors
Publisher: [Piscataway, New Jersey] : IEEE, [2018] ©2018
Edition/Format:   eBook : Document : Conference publication : English
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy online

Links to this item

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: hosted by IMECAS ; technically sponsored by IEEE Electronics Packaging Society, EMPT ; organized by Fudan University ; editors, Tianchun Ye [and 3 others]. ; ; Tianchun Ye; Institute of Microelectronics of Chinese Academy of Sciences,; IEEE Electronics Packaging Society,; Zhongguo dian zi xue hui. Electronics Manufacturing & Packaging Technology Society,; Fu dan da xue (Shanghai, China),; Institute of Electrical and Electronics Engineers,
OCLC Number: 1061045635
Notes: "IEEE Catalog Number: CFP18553-ART."
Description: 1 online resource (various pagings) : illustrations
Other Titles: 19th International Conference on Electronic Packaging Technology
Proceedings, 2018 19th International Conference on Electronic Packaging Technology (ICEPT)
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Responsibility: hosted by IMECAS ; technically sponsored by IEEE Electronics Packaging Society, EMPT ; organized by Fudan University ; editors, Tianchun Ye [and 3 others].

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.

Similar Items

Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/1061045635> # ICEPT 2018 : 第十八届电子封装技术国际会议 = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China
    a schema:Book, schema:CreativeWork, schema:MediaObject ;
    library:oclcnum "1061045635" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nju> ;
    rdfs:label "Di shi ba jie dian zi feng zhuang ji shu guo ji hui yi = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China" ;
    schema:about <http://experiment.worldcat.org/entity/work/data/5527389780#Topic/electronic_packaging> ; # Electronic packaging
    schema:alternateName "2018 19th International Conference on Electronic Packaging Technology (ICEPT)" ;
    schema:alternateName "Proceedings, 2018 19th International Conference on Electronic Packaging Technology (ICEPT)" ;
    schema:alternateName "19th International Conference on Electronic Packaging Technology" ;
    schema:bookFormat schema:EBook ;
    schema:contributor <http://experiment.worldcat.org/entity/work/data/5527389780#Organization/ieee_electronics_packaging_society> ; # IEEE Electronics Packaging Society,
    schema:contributor <http://experiment.worldcat.org/entity/work/data/5527389780#Organization/institute_of_electrical_and_electronics_engineers> ; # Institute of Electrical and Electronics Engineers,
    schema:contributor <http://experiment.worldcat.org/entity/work/data/5527389780#Organization/fu_dan_da_xue_shanghai_china> ; # Fu dan da xue (Shanghai, China),
    schema:contributor <http://experiment.worldcat.org/entity/work/data/5527389780#Organization/zhongguo_dian_zi_xue_hui_electronics_manufacturing_&_packaging_technology_society> ; # Zhongguo dian zi xue hui. Electronics Manufacturing & Packaging Technology Society,
    schema:contributor <http://experiment.worldcat.org/entity/work/data/5527389780#Organization/institute_of_microelectronics_of_chinese_academy_of_sciences> ; # Institute of Microelectronics of Chinese Academy of Sciences,
    schema:copyrightYear "2018" ;
    schema:creator <http://experiment.worldcat.org/entity/work/data/5527389780#Meeting/international_conference_on_electronic_packaging_technology_19th_2018_shanghai_china> ; # International Conference on Electronic Packaging Technology (19th : 2018 : Shanghai, China)
    schema:datePublished "2018" ;
    schema:editor <http://experiment.worldcat.org/entity/work/data/5527389780#Person/ye_tianchun> ; # Tianchun Ye
    schema:exampleOfWork <http://worldcat.org/entity/work/id/5527389780> ;
    schema:genre "Conference papers and proceedings"@en ;
    schema:genre "Conference publication"@en ;
    schema:inLanguage "en" ;
    schema:name "ICEPT 2018 : 第十八届电子封装技术国际会议 = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China"@en ;
    schema:productID "1061045635" ;
    schema:url <https://ieeexplore.ieee.org/servlet/opac?punumber=8464037> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/1061045635> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/5527389780#Meeting/international_conference_on_electronic_packaging_technology_19th_2018_shanghai_china> # International Conference on Electronic Packaging Technology (19th : 2018 : Shanghai, China)
    a bgn:Meeting, schema:Event ;
    schema:location <http://experiment.worldcat.org/entity/work/data/5527389780#Place/shanghai_china> ; # Shanghai, China)
    schema:name "International Conference on Electronic Packaging Technology (19th : 2018 : Shanghai, China)" ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Organization/fu_dan_da_xue_shanghai_china> # Fu dan da xue (Shanghai, China),
    a schema:Organization ;
    schema:name "Fu dan da xue (Shanghai, China)," ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Organization/ieee_electronics_packaging_society> # IEEE Electronics Packaging Society,
    a schema:Organization ;
    schema:name "IEEE Electronics Packaging Society," ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Organization/institute_of_electrical_and_electronics_engineers> # Institute of Electrical and Electronics Engineers,
    a schema:Organization ;
    schema:name "Institute of Electrical and Electronics Engineers," ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Organization/institute_of_microelectronics_of_chinese_academy_of_sciences> # Institute of Microelectronics of Chinese Academy of Sciences,
    a schema:Organization ;
    schema:name "Institute of Microelectronics of Chinese Academy of Sciences," ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Organization/zhongguo_dian_zi_xue_hui_electronics_manufacturing_&_packaging_technology_society> # Zhongguo dian zi xue hui. Electronics Manufacturing & Packaging Technology Society,
    a schema:Organization ;
    schema:name "Zhongguo dian zi xue hui. Electronics Manufacturing & Packaging Technology Society," ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Person/ye_tianchun> # Tianchun Ye
    a schema:Person ;
    schema:familyName "Ye" ;
    schema:givenName "Tianchun" ;
    schema:name "Tianchun Ye" ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Place/shanghai_china> # Shanghai, China)
    a schema:Place ;
    schema:name "Shanghai, China)" ;
    .

<http://experiment.worldcat.org/entity/work/data/5527389780#Topic/electronic_packaging> # Electronic packaging
    a schema:Intangible ;
    schema:name "Electronic packaging"@en ;
    .

<http://www.worldcat.org/title/-/oclc/1061045635>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/1061045635> ; # ICEPT 2018 : 第十八届电子封装技术国际会议 = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China
    schema:dateModified "2019-02-09" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.