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Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA

Author: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
Publisher: New York, N.Y. : ASME, ©2007.
Series: EPP (Series), v. 6.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Mechanical Engineering Congress and Exposition (2006 : Chicago, Ill.).
Electronic and photonics packaging.
New York : American Society of Mechanical Engineers, ©2007
(OCoLC)606529210
Online version:
International Mechanical Engineering Congress and Exposition (2006 : Chicago, Ill.).
Electronic and photonics packaging.
New York : American Society of Mechanical Engineers, ©2007
(OCoLC)608343958
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
ISBN: 0791847691 9780791847695
OCLC Number: 133095070
Description: xix, 526 pages : illustrations ; 28 cm.
Contents: 2006 ASME MEMS/NEMS Packaging Symposium --
Symposium on Ecoelectronics --
Symposium on Novel Nano/Micro Materials and Structures for Electronic/Photonic Packaging --
Symposium on Quality and Reliability of Electronic/Photonic Packaging --
Multi-scale electrical and mechanical systems.
Series Title: EPP (Series), v. 6.
Responsibility: sponsored by the Electronic and Photonic Packaging Division, ASME.

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