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The electronic packaging handbook

Author: Glenn R Blackwell
Publisher: Boca Raton, FL : CRC Press : IEEE Press, ©2000.
Series: Electronics handbook series.
Edition/Format:   eBook : Document : EnglishView all editions and formats

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. This book offers an information on the design, manufacturing, and testing of  Read more...


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Genre/Form: Guides, manuels, etc
Additional Physical Format: Electronic packaging handbook
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Glenn R Blackwell
ISBN: 0849385911 9780849385919
OCLC Number: 77351982
Notes: Titre de l'écran-titre (visionné le 29 avril 2002).
Contents: Fundamentals of the Design ProcessSurface Mount TechnologyIntegrated Circuit PackagesDirect Chip AttachCircuit BoardsEMC and PCB DesignHybrid AssembliesInterconnectsDesign for TestAdhesive and Its ApplicationThermal ManagementTestingInspectionPackage/EnclosureElectronics Package Reliability and Failure Analysis: A Micromechanics-Based ApproachProduct Safety and Third-Party CertificationAppendix A: DefinitionsIndex
Series Title: Electronics handbook series.
Responsibility: edited by Glenn R. Blackwell.


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"highly recommendedenough detailprovides essential factural information on the design, manufacturing, and testing of electronic devices and systemsthis book is primarily for engineers and technicians Read more...

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