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Heat management in integrated circuits : on-chip and system-level monitoring and cooling

Author: Seda Ogrenci-Memik
Publisher: London, United Kingdom : The Institution of Engineering and Technology, 2015. ©2016
Series: Materials, circuits and devices series, 28.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins,  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Ogrenci-Memik, Seda.
Heat management in integrated circuits.
London, United Kingdom : The Institution of Engineering and Technology, 2015
(OCoLC)935526988
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Seda Ogrenci-Memik
ISBN: 9781849199353 1849199353 9781523101009 1523101008
OCLC Number: 934678500
Description: 1 online resource (ix, 253 pages) : illustrations
Contents: Heat in integrated circuits and systems --
On-chip temperature sensing --
Dynamic thermal management --
Active cooling --
Mitigating thermal events at the system level and above --
Emerging directions in thermal-aware systems.
Series Title: Materials, circuits and devices series, 28.
Responsibility: Seda Ogrenci-Memik.

Abstract:

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as  Read more...

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