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Inductive sensors for industrial applications

Author: Sorin Fericean
Publisher: Norwood, MA : Artech House, [2019]
Series: Microelectromechanical systems series.
Edition/Format:   Print book : EnglishView all editions and formats
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Document Type: Book
All Authors / Contributors: Sorin Fericean
ISBN: 9781630812553 1630812552
OCLC Number: 1051687848
Description: xvi, 525 pages ; 27 cm.
Contents: Note continued: 14.7. IO-Link an Up-to-Date Sensor Communication System --
14.7.1. IO-Link at a Glance --
14.7.2. ISO Reference Model of the IO-Link Interface --
14.7.3. IO-Link Communication Flow --
14.7.4. IO-Link Hardware --
14.8. Conclusions --
References. Machine generated contents note: 1.1. General Sensor Definition --
1.1.1. Sensor or Transducer --
1.1.2. IEEE Sensor Definition and Block Diagram --
1.1.3. Inductive Sensor Definition and Functional Block Schematic --
1.2. Types of Inductive Sensors and Specific Classification Criteria --
1.2.1. Contact or Contactless Detection --
1.2.2. Position versus Displacement --
1.2.3. Absolute or Incremental Reading --
1.2.4. Linear or Angular Configuration --
1.3. Main Features of Inductive Sensors: Definitions and Typical Values --
1.3.1. Supply Conditions and Limitations --
1.3.2. Sensing Range, Zero and Span, and Hysteresis --
1.3.3. Sensitivity and Nonlinearity, Linearity Error --
1.3.4. Accuracy, Resolution, and Repeatability: Three Precision Criterions --
1.3.5. Drift, Temperature Effects, and Temperature Ranges --
1.3.6. Dynamic Specification, Response Time and Cutoff Frequency, and Turn On and Turn Off Times --
1.3.7. Analog, Binary or Digital, and Voltage or Current Output Types --
References --
2.1. Specific Product Standards and Requirements --
2.1.1. International Electrotechnical Commission Standard IEC 60947-5-2 --
2.1.2. International Electrotechnical Commission Standard IEC 60947-5-7 --
2.2. Basic and Specific EMC/EMI Standards --
2.2.1. Resilience against Electrostatic Discharges --
2.2.2. Resilience against Radiated Electromagnetic Fields --
2.2.3. Resilience against Fast Transients: EFT, Burst --
2.2.4. Resilience against Impulse Voltage (Surge) --
2.2.5. Resilience against Common Mode Conducted Disturbances --
2.2.6. Magnetic Field Immunity Test --
2.2.7. Immunity to Voltage Dips and Interruptions --
2.2.8. Summary of the EMC Test Conditions for Inductive Proximity Sensors --
2.3. Shock and Vibration Requirements --
2.4. International Protection Classification --
2.5. Intrinsic Safety, Product Safety Certification --
2.6. Reliability and Availability --
2.6.1. Mean Time Between Failures, Mean Time to Failure, and Failure Rate and Availability --
2.6.2. Highly Accelerated Life Test --
References --
3.1. Overview of the Sensor Classification --
3.2. Specific Embedding of Inductive Sensors --
3.3. Main Types of Inductive Sensors --
3.3.1. Magnetoelastic Systems --
3.3.2. Electrodynamic Systems --
3.3.3. Electromagnetic Systems with Closed Magnetic Loop --
3.3.4. Electromagnetic Systems with Open Magnetic Loop --
3.3.5. Variable Differential Transformers --
3.3.6. Systems Based on the Eddy Currents Evaluation --
3.3.7. Variable Transformers: Microsyn, Synchro, and Resolver --
3.3.8. Final Considerations of Main Inductive Sensor Categories --
3.4. Global Inductive Sensor Market: Size, Share, Growth, Trends, and Forecast --
3.4.1. Global Sensor Market --
3.4.2. Global P&D Sensor Market --
3.4.3. Global IS Market --
References --
4.1. Analytical Methods of ISE --
4.1.1. Inductors: Inductance, Impedance, Admittance, and Immittance --
4.1.2. Quality Factor of an Inductor --
4.1.3. Impedance and Q-Factor of a Resonant Circuit --
4.2. Measuring Methods to Evaluate the ISE --
4.2.1. Experimental Methods --
4.2.2. Measuring Methods Suitable to be implemented in ISE --
4.3. Modern Computer-Assisted Analysis and Synthesis of ISE --
4.3.1. Fundamentals of the Computer-Aided Electromagnetic Field Simulation --
4.3.2. Field Simulation Software Tools --
4.3.3. Simulation with ANSYS Maxwell Tool --
4.3.4. Flow Chart of a Maxwell Field-Simulation Project: Concrete Example --
References --
5.1. Fundamental Inductors: Solenoid and Toroid --
5.1.1. The Solenoid --
5.1.2. The Toroid --
5.2. Wire-Wound Coils with Air Cores --
5.3. Wire-Wound Coils with Magnetic Cores --
5.3.1. Inductance of Wire-Wound Coils with Magnetic Cores --
5.3.2. Core Factor and Effective Core Parameters --
5.3.3. Losses Caused by Cores: Total Formula of the Inductor Impedance at Full Length --
5.4. Printed Flat Spiral Coils --
5.5. Integrated Coils on Silicon Substrate --
5.6. Active Inductors, Gyrators --
References --
6.1. Ferrites --
6.1.1. Ferrites: Classification, Definitions, and Properties --
6.1.2. Overview of MnZn Ferrite Specifications: Cross-Reference List of Available MnZn Ferrites --
6.1.3. Ferrite Core Manufacturing Process: Technical Core Types --
6.2. Permaloy and Mu-Metals --
6.3. Soft Iron Alloys --
References --
7.1. Generic Functional Diagram of the Inductive Sensor's Evaluation Electronics --
7.2. Inductive Sensor with Discrete Evaluation Electronics --
7.3. Inductive Sensor with Integrated Evaluation Electronics --
7.3.1. Overview of Bipolar Integration Technology --
7.3.2. Overview of Complementary Metal-Oxide-Semiconductor Processes: Benchmarking CMOS versus Bipolar Technology --
7.3.3. Evaluation Electronics of Inductive Sensors with Integrated Circuits --
7.4. ASIC Implementations in the Evaluation Electronics for Inductive Sensors --
7.4.1. Single-ASIC Implementations: The Classical Device TCA505 --
7.4.2. Multi-ASIC Versions --
7.4.3. Systems on Chip SOC --
7.5. Software-Defined Sensors: Fantasy or the Inductive Sensor of Tomorrow? --
References --
8.1. Theory of Resonant LC Circuits: Series versus Parallel --
8.1.1. Characteristics of the Series Resonant LC Circuit --
8.1.2. Characteristics of the Parallel Resonant LC Circuit --
8.2. General Theory of the Oscillator --
8.2.1. Harmonic Oscillator --
8.2.2. Linear Oscillator with Losses --
8.2.3. Oscillators with Loss Cancellation by Positive Feedback Operation --
8.3. Convenient Types of LC Oscillators for Inductive Sensors --
8.3.1. Transistor-Based, Positive-Feedback Oscillators --
8.3.2. Ring-Circuit Oscillators with LC Dipole --
8.3.3. Differential Amplifier Oscillators with LC Dipole --
8.3.4. Bridge-Network Oscillators --
8.3.5. Oscillators with Pulsing DC Current Excitation --
8.3.6. Negative-Resistance Oscillators --
8.4. Function Generators --
8.4.1. Relaxation Oscillators --
8.4.2. Self-Oscillating Function Generators --
8.4.3. Timer-Chip NE555 --
8.5. Digitally Synthesized Function Generators --
References --
9.1. Signal Amplifiers --
9.1.1. Operational Amplifiers: Definition and Applications --
9.1.2. Operational Amplifiers: Frequency Response, Stability, and Compensation --
9.2. Precision AC/DC Signal Converters --
9.2.1. Precision Rectifiers --
9.2.2. Peak Detectors --
9.2.3. Synchronous Rectifiers --
9.3. Sample-and-Hold Systems --
9.4. Signal Linearization, Linearization Methods --
9.4.1. Analog Hardware-Based Linearization --
9.4.2. Software-Based Linearization --
9.4.3. Logic Hardware Linearization --
9.4.4. Hardware-Software Mixed Approaches --
9.4.5. Artificial Neural Networks Approaches --
9.5. Comparators, Window Discriminators --
9.6. Regenerative Comparators (Schmitt Trigger) --
9.7. Phase-Locked Loop Circuits --
9.7.1. PLL Concepts --
9.7.2. Analog PLL: Architecture and Operation --
9.7.3. PLL Linear Analysis, Stability --
9.7.4. Digital PLLs --
9.8. Digital-to-Analog and Analog-to-Digital Convertors --
9.8.1. Digital-to-Analog Converters --
9.8.2. Analog-to-Digital Converters --
References --
10.1. Output Stages for Analog Inductive Sensors --
10.1.1. Voltage Output Stages --
10.1.2. Current Telemetry: Current Output Stages --
10.1.3. Ratiometric Voltage Outputs --
10.2. Output Drivers for Digital Inductive Sensors --
10.2.1. Switched Inductive Loads, Voltage Clamps --
10.2.2. Output Drivers with Commercial Parts --
10.2.3. Monolithic Integrated Output Drivers in ASICs --
References --
11.1. Power Supply Circuits --
11.1.1. Series Voltage Regulators/References --
11.1.2. Shunt Voltage Regulators --
11.2. Standard and Supplimentary Sensor Protection Functions --
11.2.1. Open Wire Protection --
11.2.2. Reversed Polarity Protection --
11.2.3. Protection against High-Energetic Pulses (Surge) --
References --
12.1. Traditional Sensor Trimming Procedures with Commercial Components --
12.1.1. Trimmable Resistors --
12.1.2. Rejustor --
12.1.3. Manual Mechanical Potentiometers --
12.1.4. Digital Potentiometers --
12.2. Specific Programmable Electronic Devices used to Calibrate Inductive Sensors --
12.2.1. Established Methods for the Trimming of Inductive Sensors --
12.2.2. ASIC and ASIC Sections for Trimming of Inductive Sensors --
References --
13.1. Temperature Sensing Devices --
13.1.1. Passive Temperature Probes --
13.1.2. Active Temperature-Dependent Circuits --
13.1.3. Active Temperature-Independent References: Bandgap References --
13.2. Theoretical Considerations Regarding the Temperature Behavior of ISEs --
13.3. Improvement of the Temperature Behavior by Passive Temperature Compensations --
13.4. Active Analog Hardware-Based Temperature Compensation Methods of ISs --
13.5. Active Digital Temperature Compensation Methods of ISs --
References --
14.1. Basics of the Data Communication Systems --
14.1.1. Communication Network Topologies --
14.1.2. Network Access Procedures --
14.1.3. Industrial Fieldbuses: Definition and Features --
14.1.4. ISO/OSI Network Reference Model --
14.2. Requirement Description for the Sensor and Actuator Communication Level --
14.3. Intelligent Sensors --
14.4. RS-232, RS-422, and RS-484 Interfaces --
14.4.1. RS-232 --
14.4.2. RS-422 and RS-485 --
14.5. Synchronous Serial Buses for Sensors --
14.5.1. 4-Wire Serial Peripheral Interface --
14.5.2. 2-Wire Interintegrated Interface --
14.6. AS Interface --
14.6.1. AS Interface at a Glance --
14.6.2. AS Interface Slave Specification --
14.6.3. ISO Reference Model of the AS Interface
Series Title: Microelectromechanical systems series.
Responsibility: Sorinb Fericean.

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