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Interconnect Technology for Three-Dimensional Chip Integration.

Author: Andreas Munding
Publisher: Göttingen : Cuvillier Verlag, 2007.
Edition/Format:   eBook : Document : EnglishView all editions and formats
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Munding, Andreas.
Interconnect Technology for Three-Dimensional Chip Integration.
Göttingen : Cuvillier Verlag, ©2007
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Andreas Munding
ISBN: 9783736924062 3736924062
OCLC Number: 1003263664
Description: 1 online resource (137 pages)
Contents: 9783867274067.jpg; Diss1klein.pdf.

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