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Istfa 2005 : Proceedings of the 31st International Symposium for Testing and Failure Analysis.

Author: Lee Knauss
Publisher: Materials Park : A S M International Palo Alto : Ebrary, Incorporated [distributor] 2005
Edition/Format:   eBook : Document : English
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Genre/Form: Electronic books
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Lee Knauss
ISBN: 9781615030880 1615030883
OCLC Number: 793585196
Description: 1 online resource
Contents: Diffractive Lenses for High Resolution Laser Based Failure Analysis --
Dopant Imaging on Front Surface of Silicon Devices with a Coaxial Photon- Ion Column --
Newly-Developed Scanning Laser-SQUID Microscope --
Stacked-Die Failure Mechanisms for an Octal, Current Input 20-Bit Analog- to- Digital Converter --
Silver-silver versus tin-silver electrical connectors for high current and --
Analysis of Al-over-Cu Bond Pad Hillock and Pit Hole Defects --
Die Edge Thin Film Delamination on the Bottom Die of a Stacked Chip Scale Package ( SCSP) Multi-Point Probing on 65nm Silicon Technology using Static IREM-based Methodology --
Failure Analysis of Soft Single Column Failure in Advanced Nano SRAM Device with Internal Probing Techniques --
The Effectiveness of OBIRCH Based Fault Isolation for Sub- 90nm CMOS Technologies --
Dislocation related Leakage in Advanced CMOS devices --
Contacting Diffusion with FIB for Backside Circuit Edit --
Procedures and Material Analysis --
Novel and Practical Method of Through Silicon FIB Editing of SOI Devices --
The Joy of SOI: As Viewed From A Backside Focused Ion Beam ( FIB) Perspective. Complementary Optical Techniques for Advanced IC Failure Analysis --
Case Study --
Scanning Optical Microscopy Application in Micron Memory Devices --
Topside Defect Localization Using OBIRCH Analysis --
Advanced electrical characterization of 90 nm Soft Bit Failure by Nano Probing technique --
Dynamic Laser Delay Variation Mapping (DVM) Implementations and Applications --
Soft Defect Localization Techniques without a Synchronization Signal to the Laser Scanning Module --
Guideline for interpreting IR Laser Stimulation signal on semiconductors materials and for improving failure analysis flow. Lock-In Assisted Soft Defect Localization (LIA-SDL) and its Application In Scan Shift Problems --
Furthering the Business Proposition of a Robust System Level Failure Analysis Framework: A Focus on Enabling Product Services --
Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY --
Analysis Methods for Characterizing Drop Test Robustness of Lead-free FBGAś --
Developing a More Inclusive System Level ESD Characterization Methodology --
X-ray Fluorescence Imaging For High Resolution Elemental Mapping. 3-D EBIC Technique using FIB and EB Double Beam System --
Case studies of the use of Image Processing in Metrology and Failure Analysis. --
Single Device Characterization by Nano- probing to Identify Failure Root Cause --
Analysis of DRAM Standby Current Failure due to Hot Electron Induced Punch-through ( HEIP) of PMOS transistor --
Stacked-Die Analysis Using C-Mode Scanning Acoustic Microscope --
DuPont EKC265TM as a Copper Metal Etchant to Assist FIB Edits through Large Copper Power Supply Lines --
Edge Enhancement for Acoustic Microscopy of Flip Chip Devices.

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