Find a copy online
Links to this item
Find a copy in the library
Finding libraries that hold this item...
Details
| Genre/Form: | Conference papers and proceedings San Francisco (Calif., 1995) Congresses Congrès |
|---|---|
| Additional Physical Format: | Online version: Low-dielectric constant materials-- synthesis and applications in microelectronics. Pittsburgh, Pa. : Materials Research Society, c995 (OCoLC)714904462 |
| Material Type: | Conference publication, Internet resource |
| Document Type: | Book, Internet Resource |
| All Authors / Contributors: |
T -M Lu |
| ISBN: | 1558992847 9781558992849 |
| OCLC Number: | 32822346 |
| Description: | xi, 288 pages : illustrations ; 24 cm. |
| Contents: | Materials Research Society Symposium Proceedings -- Methods and Needs for Low K Material Research / Chiu H. Ting and Thomas E. Seidel -- Fluorinated, Low Thermal Expansion Coefficient Polyimides for Interlayer Dielectric Applications: Thermal Stability, Refractive Index and High Temperature Modulus Measurements / Brian C. Auman -- Investigations of the Low Dielectric Constant Fluorinated Polyimide for Use as the Interlayer Dielectric in ULSI / Y. K. Lee, S. P. Murarka, S.-P. Jeng and B. Auman -- Vapor Deposition of Very Low K Polymer Films, Poly(naphthalene), Poly(fluorinated naphthalene) / C.-I. Lang, G.-R. Yang, J. A. Moore and T.-M. Lu -- Novel Photocurable Materials for Spin-On Dielectric Films / James V. Crivello -- Synthesis and Characterization of Fluorinated Poly(arylethers): Organic Polymers for IC IMD / Neil H. Hendricks, Kreister S. Y. Lau, Aaron R. Smith and W. Brad Wan -- High Temperature Alternating Copolymers as Dielectric Materials: Synthesis, Structure and Properties / M. Ree, W. H. Goh, J.-W. Park, M.-H. Lee and S. B. Rhee -- Polyimide Nanofoams for Low Dielectric Applications / K. R. Carter, H. J. Cha, R. A. DiPietro, C. J. Hawker, J. L. Hedrick, J. W. Labadie, J. E. McGrath, T. P. Russell, M. I. Sanchez, S. A. Swanson, W. Volksen and D. Y. Yoon -- Low Dielectric Constant Thermostable Polymers / B. Sillion, G. Rabilloud, J. Garapon, O. Gain and J. Vallet -- Low-Dielectric Constant Film Formation by Plasma Fluorination of Hydrocarbon Polymers / Hiroshi Kudo, Rika Shinohara and Masao Yamada Low Dielectric Constant Thermosetting Resins for Microelectronics / Leonard J. Buckley, Arthur Snow, James Griffith, Henry S. W. Hu and Mark Ray -- Low Thermal Budget Processing of Organic Dielectrics / R. Sharangpani, R. Singh, K. C. Cherukuri and R. P. S. Thakur -- Thermal and Mechanical Properties of Low K Polymers / Chien Chiang, Anne S. Mack, Chuanbin Pan, Yul-Lin Ling and David B. Fraser -- Dielectric Properties of Low Dielectric Constant Polymeric Materials / Flora S. Ip and Chiu Ting -- Thermal and Mechanical Properties of Polyimide Films / S. T. Chen -- Glass Transition Temperature of Ultrathin Polymer Films on Silicon / Wen-Li Wu, William E. Wallace and John Van Zanten -- Dielectric Measurements on Printed-Wiring and Circuit Boards, Thin Films, and Substrates: An Overview / James Baker-Jarvis and Chriss A. Jones -- Digital Optical Imaging of Benzocyclobutene (BCB) Thin Films on Silicon Wafers / Robert A. DeVries, Reed A. Shick and Bethany K. Johnson -- Low Dielectric Constant Polymers for On-Chip Interlevel Dielectrics with Copper Metallization / Ronald J. Gutmann, T. Paul Chow, David J. Duquette, Toh-Ming Lu, John F. McDonald and Shyam P. Murarka -- Process Integration of Low-Dielectric-Constant Materials / Shin-Puu Jeng, Kelly Taylor, Mi-Chang Chang, Larry Ting, Charles Lee, Peter McAnally, Tom Seha, Ken Numata, Tsuyoshi Tanaka and Robert H. Havemann -- Metal-Parylene Interconnection Systems / S. Dabral, X. Zhang, B. Wang, G.-R. Yang, T.-M. Lu and J. F. McDonald Integration of BPDA-PDA Polyimide with Two Levels of Al(Cu) Interconnects / J. T. Wetzel, Y. T. Lii, S. M. Filipiak, B.-Y. Nguyen, E. O. Travis, R. W. Fiordalice, M. E. Winkler, C. C. Lee and J. Peschke -- Investigations of the Chemical-Mechanical Polishing of Polymer Films for ILD Applications / Jan M. Neirynck, S. P. Murarka and R. J. Gutmann -- Fluorinated SiO[subscript 2] Films for Interlayer Dielectrics in Quarter-Micron ULSI Multilevel Interconnections / Tetsuya Homma -- Preparation and Properties of Fluorinated Amorphous Carbon Thin Films by Plasma Enhanced Chemical Vapor Deposition / Kazuhiko Endo and Toru Tatsumi -- Material Characterization of Methyl Siloxane SOGS / Ken Numata, Thomas R. Seha, Shin-Puu Jeng and Tsuyoshi Tanaka -- Preparation of Low-Density Xerogels at Ambient Pressure for Low K Dielectrics / D. M. Smith, J. Anderson, C. C. Cho, G. P. Johnston and S. P. Jeng -- Silica Aerogel: An Intrinsically Low Dielectric Constant Material / Lawrence W. Hrubesh -- Evaluation of Amorphous Diamond-Like Carbon and Boron Nitride Films as Low Permittivity Dielectrics / J. P. Sullivan, T. A. Friedmann, C. A. Apblett, M. P. Siegal, N. Missert, M. L. Lovejoy, P. B. Mirkarimi and K. F. McCarty -- Modification Effects in Argon Plasma Treated SiO[subscript 2] Spin-On Glass / Min Park, Joong Whan Lee, Jin Gun Koo, Kyung Soo Kim, Hyung Joun Yoo, Kee Soo Nam and Jin Jang. |
| Series Title: | Materials Research Society symposia proceedings, v. 381. |
| Responsibility: | editors, T.-M. Lu [and others]. |
Reviews
User-contributed reviews
Add a review and share your thoughts with other readers.
Be the first.
Add a review and share your thoughts with other readers.
Be the first.
Tags
Add tags for "Low-dielectric constant materials-- synthesis and applications in microelectronics : symposium held April 17-19, 1995, San Francisco, California, U.S.A.".
Be the first.
Similar Items
Related Subjects:(14)
- Electronics -- Materials -- Congresses.
- Electric insulators and insulation -- Congresses.
- Materials -- Electric properties -- Congresses.
- Électronique -- Matériaux -- Congrès.
- Matériaux -- Propriétés électriques -- Congrès.
- Electric insulators and insulation.
- Electronics -- Materials.
- Materials -- Electric properties.
- Mikroelektronik
- Werkstoff
- Kongreß.
- Electric insulators and insulation -- Congresses
- Electronics -- Materials -- Congresses
- Materials -- Electric properties -- Congresses
