Low-dielectric constant materials-- synthesis and applications in microelectronics : symposium held April 17-19, 1995, San Francisco, California, U.S.A. (Book, 1995) [WorldCat.org]
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Low-dielectric constant materials-- synthesis and applications in microelectronics : symposium held April 17-19, 1995, San Francisco, California, U.S.A.
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Low-dielectric constant materials-- synthesis and applications in microelectronics : symposium held April 17-19, 1995, San Francisco, California, U.S.A.

Author: T -M Lu
Publisher: Pittsburgh, Pa. : Materials Research Society, c995.
Series: Materials Research Society symposia proceedings, v. 381.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
San Francisco (Calif., 1995)
Congresses
Congrès
Additional Physical Format: Online version:
Low-dielectric constant materials-- synthesis and applications in microelectronics.
Pittsburgh, Pa. : Materials Research Society, c995
(OCoLC)714904462
Material Type: Conference publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: T -M Lu
ISBN: 1558992847 9781558992849
OCLC Number: 32822346
Description: xi, 288 pages : illustrations ; 24 cm.
Contents: Materials Research Society Symposium Proceedings --
Methods and Needs for Low K Material Research / Chiu H. Ting and Thomas E. Seidel --
Fluorinated, Low Thermal Expansion Coefficient Polyimides for Interlayer Dielectric Applications: Thermal Stability, Refractive Index and High Temperature Modulus Measurements / Brian C. Auman --
Investigations of the Low Dielectric Constant Fluorinated Polyimide for Use as the Interlayer Dielectric in ULSI / Y. K. Lee, S. P. Murarka, S.-P. Jeng and B. Auman --
Vapor Deposition of Very Low K Polymer Films, Poly(naphthalene), Poly(fluorinated naphthalene) / C.-I. Lang, G.-R. Yang, J. A. Moore and T.-M. Lu --
Novel Photocurable Materials for Spin-On Dielectric Films / James V. Crivello --
Synthesis and Characterization of Fluorinated Poly(arylethers): Organic Polymers for IC IMD / Neil H. Hendricks, Kreister S. Y. Lau, Aaron R. Smith and W. Brad Wan --
High Temperature Alternating Copolymers as Dielectric Materials: Synthesis, Structure and Properties / M. Ree, W. H. Goh, J.-W. Park, M.-H. Lee and S. B. Rhee --
Polyimide Nanofoams for Low Dielectric Applications / K. R. Carter, H. J. Cha, R. A. DiPietro, C. J. Hawker, J. L. Hedrick, J. W. Labadie, J. E. McGrath, T. P. Russell, M. I. Sanchez, S. A. Swanson, W. Volksen and D. Y. Yoon --
Low Dielectric Constant Thermostable Polymers / B. Sillion, G. Rabilloud, J. Garapon, O. Gain and J. Vallet --
Low-Dielectric Constant Film Formation by Plasma Fluorination of Hydrocarbon Polymers / Hiroshi Kudo, Rika Shinohara and Masao Yamada Low Dielectric Constant Thermosetting Resins for Microelectronics / Leonard J. Buckley, Arthur Snow, James Griffith, Henry S. W. Hu and Mark Ray --
Low Thermal Budget Processing of Organic Dielectrics / R. Sharangpani, R. Singh, K. C. Cherukuri and R. P. S. Thakur --
Thermal and Mechanical Properties of Low K Polymers / Chien Chiang, Anne S. Mack, Chuanbin Pan, Yul-Lin Ling and David B. Fraser --
Dielectric Properties of Low Dielectric Constant Polymeric Materials / Flora S. Ip and Chiu Ting --
Thermal and Mechanical Properties of Polyimide Films / S. T. Chen --
Glass Transition Temperature of Ultrathin Polymer Films on Silicon / Wen-Li Wu, William E. Wallace and John Van Zanten --
Dielectric Measurements on Printed-Wiring and Circuit Boards, Thin Films, and Substrates: An Overview / James Baker-Jarvis and Chriss A. Jones --
Digital Optical Imaging of Benzocyclobutene (BCB) Thin Films on Silicon Wafers / Robert A. DeVries, Reed A. Shick and Bethany K. Johnson --
Low Dielectric Constant Polymers for On-Chip Interlevel Dielectrics with Copper Metallization / Ronald J. Gutmann, T. Paul Chow, David J. Duquette, Toh-Ming Lu, John F. McDonald and Shyam P. Murarka --
Process Integration of Low-Dielectric-Constant Materials / Shin-Puu Jeng, Kelly Taylor, Mi-Chang Chang, Larry Ting, Charles Lee, Peter McAnally, Tom Seha, Ken Numata, Tsuyoshi Tanaka and Robert H. Havemann --
Metal-Parylene Interconnection Systems / S. Dabral, X. Zhang, B. Wang, G.-R. Yang, T.-M. Lu and J. F. McDonald Integration of BPDA-PDA Polyimide with Two Levels of Al(Cu) Interconnects / J. T. Wetzel, Y. T. Lii, S. M. Filipiak, B.-Y. Nguyen, E. O. Travis, R. W. Fiordalice, M. E. Winkler, C. C. Lee and J. Peschke --
Investigations of the Chemical-Mechanical Polishing of Polymer Films for ILD Applications / Jan M. Neirynck, S. P. Murarka and R. J. Gutmann --
Fluorinated SiO[subscript 2] Films for Interlayer Dielectrics in Quarter-Micron ULSI Multilevel Interconnections / Tetsuya Homma --
Preparation and Properties of Fluorinated Amorphous Carbon Thin Films by Plasma Enhanced Chemical Vapor Deposition / Kazuhiko Endo and Toru Tatsumi --
Material Characterization of Methyl Siloxane SOGS / Ken Numata, Thomas R. Seha, Shin-Puu Jeng and Tsuyoshi Tanaka --
Preparation of Low-Density Xerogels at Ambient Pressure for Low K Dielectrics / D. M. Smith, J. Anderson, C. C. Cho, G. P. Johnston and S. P. Jeng --
Silica Aerogel: An Intrinsically Low Dielectric Constant Material / Lawrence W. Hrubesh --
Evaluation of Amorphous Diamond-Like Carbon and Boron Nitride Films as Low Permittivity Dielectrics / J. P. Sullivan, T. A. Friedmann, C. A. Apblett, M. P. Siegal, N. Missert, M. L. Lovejoy, P. B. Mirkarimi and K. F. McCarty --
Modification Effects in Argon Plasma Treated SiO[subscript 2] Spin-On Glass / Min Park, Joong Whan Lee, Jin Gun Koo, Kyung Soo Kim, Hyung Joun Yoo, Kee Soo Nam and Jin Jang.
Series Title: Materials Research Society symposia proceedings, v. 381.
Responsibility: editors, T.-M. Lu [and others].

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