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Genre/Form: | Thèses et écrits académiques |
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Material Type: | Thesis/dissertation, Manuscript |
Document Type: | Book, Archival Material |
All Authors / Contributors: |
Mylène Brachet; Jean Le Bideau; Thierry Brousse; Jannick Duchet-Rumeau; Saïd Sadki; Frédéric Favier; Université Nantes-Angers-Le Mans - COMUE.; Université de Nantes (1962-2021).; Université de Nantes. Faculté des sciences et des techniques.; École doctorale Matériaux, Matières, Molécules en Pays de la Loire (3MPL) (Le Mans).; Institut des Matériaux Jean Rouxel (Nantes). |
OCLC Number: | 1247939160 |
Description: | 1 vol. (247 p.) : ill. ; 30 cm. |
Responsibility: | Mylène Brachet ; sous la direction de Jean Le Bideau ; co-directeur de thèse Thierry Brousse. |
Abstract:
The increasing number of portable electronic devices requires to secure and miniaturize energy storage. Thus, energy storage micro-sources are required, such as micro-supercapacitors, implying the use of chemically and thermally stable solid electrolytes. These devices must be compatible with solder assembly processes such as solder reflow. It includes a short increase of temperature up to 250 °C to solder all components on an electronic card at once. Current solid electrolytes suffer from low conductivity and liquid electrolytes (organic and aqueous) cannot bear temperatures of this order. This work shows the optimization of ionogels, or confined ionic liquids, in order to use them as solid electrolytes in microsupercapacitors with nanostructured silicon electrodes. An ionogel with silica based matrix, synthesized via solgel route, was specifically developed for such devices. Ionic conductivity and degradation temperature measurements, as well as other characterizations, were carried out in order to better understand ionogel's behavior and to optimize its formulation and shaping. This allowed its deposition onto nanostructured silicon electrodes without damages. All solid-state symmetric devices were assembled. Their properties were compared to those obtained with non confined ionic liquid. The micro-supercapacitors can bear the solder reflow at 250 °C without decreasing their performance or stability. The ionogel was also transposed onto carbon based electrodes.
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