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Microelectronic interconnections and assembly : [proceedings of the NATO Advanced Research Workshop on Microelectronic Interconnections and Assembly, Prague, Czech Republic, 18-21 May, 1996]

Author: George G Harman; Pavel Mach
Publisher: Dordrecht Kluwer Acad. Publ. 1998
Series: NATO ASI series / Partnership sub-series / 3., NATO ASI series, NATO, 1995 ;, 54
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

This text covers the proceedings of the 1996 NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the  Read more...

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Details

Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: George G Harman; Pavel Mach
ISBN: 0792351398 9780792351399
OCLC Number: 245952017
Notes: Includes index
Description: XIV, 299 Seiten
Contents: Packaging and interconnection trends - present and future; solder and flip chip interconnections and assembly; single chip interconnection and qualification - wire bonding and TAB; multichip module interconnections and assembly I; discussion with the Dean and Vice Chancellor of the Czech Technical University and people from the Czech and the Slovak ISHM chapters; multichip module interconnections and assembly II; thick film interconnections and metallurgical interactions I; thick film interconnections and metallurgical interactions II.
Series Title: NATO ASI series / Partnership sub-series / 3., NATO ASI series, NATO, 1995 ;, 54
Responsibility: ed. by George Harman and Pavel Mach
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