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Microelectronic Interconnections and Assembly

Author: George Harman; Pavel Mach
Publisher: Dordrecht : Springer Netherlands, 1998.
Series: NATO ASI Series, 3. High Technology,, 54.
Edition/Format:   eBook : Bibliographic data : English
Summary:
The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. <br/> The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest  Read more...
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Details

Genre/Form: Electronic books
Conference papers and proceedings
Congresses
Additional Physical Format: Printed edition:
Material Type: Bibliographic data, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: George Harman; Pavel Mach
ISBN: 9789401151351 9401151350 9789401061599 9401061599
OCLC Number: 840311126
Description: 1 online resource (314 pages)
Contents: Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
Series Title: NATO ASI Series, 3. High Technology,, 54.
Other Titles: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
Responsibility: edited by George Harman, Pavel Mach.

Abstract:

Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996  Read more...

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The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported.
Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
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