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Microelectronic ultrasonic bonding.

Author: George G Harman
Publisher: [Washington] U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.] 1974.
Series: NBS special publication, 400-2.; Semiconductor measurement technology.
Edition/Format:   Print book : National government publication : EnglishView all editions and formats
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Additional Physical Format: Online version:
Harman, George G.
Microelectronic ultrasonic bonding.
[Washington] U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.] 1974
(OCoLC)609310877
Material Type: Government publication, National government publication
Document Type: Book
All Authors / Contributors: George G Harman
OCLC Number: 1119404
Notes: "CODEN: XNBSAV."
Description: vi, 102 pages illustrations 26 cm.
Series Title: NBS special publication, 400-2.; Semiconductor measurement technology.
Responsibility: George G. Harman, editor.

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Primary Entity

<http://www.worldcat.org/oclc/1119404> # Microelectronic ultrasonic bonding.
    a schema:Book, schema:CreativeWork ;
   library:oclcnum "1119404" ;
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/dcu> ;
   library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/354056628#Place/washington> ; # Washington
   schema:about <http://dewey.info/class/389.08/> ;
   schema:about <http://id.worldcat.org/fast/1160717> ; # Ultrasonic welding
   schema:about <http://id.worldcat.org/fast/1019757> ; # Microelectronics
   schema:bookFormat bgn:PrintBook ;
   schema:creator <http://viaf.org/viaf/91671255> ; # George G. Harman
   schema:datePublished "1974" ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/354056628> ;
   schema:genre "Government publication"@en ;
   schema:genre "National government publication"@en ;
   schema:inLanguage "en" ;
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/354056628#Series/nbs_special_publication_400_2_semiconductor_measurement_technology> ; # NBS special publication 400-2. Semiconductor measurement technology
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/354056628#Series/semiconductor_measurement_technology> ; # Semiconductor measurement technology.
   schema:isPartOf <http://experiment.worldcat.org/entity/work/data/354056628#Series/nbs_special_publication> ; # NBS special publication ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/609310877> ;
   schema:name "Microelectronic ultrasonic bonding."@en ;
   schema:productID "1119404" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/1119404#PublicationEvent/washingtonu_s_national_bureau_of_standards_for_sale_by_the_supt_of_docs_u_s_govt_print_off_1974> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/354056628#Agent/u_s_national_bureau_of_standards_for_sale_by_the_supt_of_docs_u_s_govt_print_off> ; # U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/1119404> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/354056628#Agent/u_s_national_bureau_of_standards_for_sale_by_the_supt_of_docs_u_s_govt_print_off> # U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.
    a bgn:Agent ;
   schema:name "U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off." ;
    .

<http://experiment.worldcat.org/entity/work/data/354056628#Series/nbs_special_publication> # NBS special publication ;
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/1119404> ; # Microelectronic ultrasonic bonding.
   schema:name "NBS special publication ;" ;
    .

<http://experiment.worldcat.org/entity/work/data/354056628#Series/nbs_special_publication_400_2_semiconductor_measurement_technology> # NBS special publication 400-2. Semiconductor measurement technology
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/1119404> ; # Microelectronic ultrasonic bonding.
   schema:name "NBS special publication 400-2. Semiconductor measurement technology" ;
    .

<http://experiment.worldcat.org/entity/work/data/354056628#Series/semiconductor_measurement_technology> # Semiconductor measurement technology.
    a bgn:PublicationSeries ;
   schema:hasPart <http://www.worldcat.org/oclc/1119404> ; # Microelectronic ultrasonic bonding.
   schema:name "Semiconductor measurement technology." ;
    .

<http://id.worldcat.org/fast/1019757> # Microelectronics
    a schema:Intangible ;
   schema:name "Microelectronics"@en ;
    .

<http://id.worldcat.org/fast/1160717> # Ultrasonic welding
    a schema:Intangible ;
   schema:name "Ultrasonic welding"@en ;
    .

<http://viaf.org/viaf/91671255> # George G. Harman
    a schema:Person ;
   schema:familyName "Harman" ;
   schema:givenName "George G." ;
   schema:name "George G. Harman" ;
    .

<http://www.worldcat.org/oclc/609310877>
    a schema:CreativeWork ;
   rdfs:label "Microelectronic ultrasonic bonding." ;
   schema:description "Online version:" ;
   schema:isSimilarTo <http://www.worldcat.org/oclc/1119404> ; # Microelectronic ultrasonic bonding.
    .


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