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Microwave and millimeter-wave electronic packaging

Author: Rick Sturdivant
Publisher: Boston [Massachusetts] ; London [England] : Artech House, 2014. ©2014
Series: Artech House microwave library.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
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Genre/Form: Electronic book
Electronic books
Additional Physical Format: Print version:
Sturdivant, Rick.
Microwave and millimeter-wave electronic packaging.
Boston, [Massachusetts] ; London, [England] : Artech House, ©2014
xvii, 261 pages
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Rick Sturdivant
ISBN: 9781608076987 1608076989 1608076970 9781608076970 9781523117420 1523117427
OCLC Number: 922474990
Description: 1 online resource (281 pages) : illustrations.
Contents: Introduction --
Materials --
Ceramic packaging --
Laminate packaging --
First-level interconnects --
Second-level interconnects --
Modules and motherboards --
Transitions and 3D packaging --
Heat transfer --
Electromagnetic modeling --
Conclusions and future horizons.
Series Title: Artech House microwave library.
Responsibility: Rick Sturdivant.

Abstract:

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --

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