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NORDPAC : 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) : June 18-20, 2017, Göteborg, Sweden.

Author: Institute of Electrical and Electronics Engineers,; Components, Packaging & Manufacturing Technology Society,; International Microelectronics and Packaging Society.
Publisher: Piscataway, NJ : IEEE, [2017] ©2017
Edition/Format:   eBook : Document : Conference publication : English
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Institute of Electrical and Electronics Engineers,; Components, Packaging & Manufacturing Technology Society,; International Microelectronics and Packaging Society.
OCLC Number: 1005139658
Notes: "CFP17M25-ART"
Description: 1 online resource : illustrations
Other Titles: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
NordPac 2017
IMAPS Nordic 2017
Microelectronics Packaging (NordPac), 2017 IMAPS Nordic Conference on

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