Organic high density interconnect structures (HDIS) : Solutions for ultra high density PWBs : IPC second annual conference : conference proceedings : November 20-21, 1997, Biltmore Hotel & Suites, Santa Clara, CA. (Book, 1997) [WorldCat.org]
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Organic high density interconnect structures (HDIS) : Solutions for ultra high density PWBs : IPC second annual conference : conference proceedings : November 20-21, 1997, Biltmore Hotel & Suites, Santa Clara, CA.

Author: Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Publisher: Northbrook, Ill. : IPC, ©1997.
Edition/Format:   Print book : Conference publication : English
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
ISBN: 1580985238 9781580985239
OCLC Number: 45508412
Notes: Cover title.
"IPC Second Annual National Conference on Organic High Density Interconnect Structures"--Prelim.
Description: 213 pages : illustrations ; 28 cm + 1 suppl

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