skip to content
Covid-19 virus
COVID-19 Resources

Reliable information about the coronavirus (COVID-19) is available from the World Health Organization (current situation, international travel). Numerous and frequently-updated resource results are available from this WorldCat.org search. OCLC’s WebJunction has pulled together information and resources to assist library staff as they consider how to handle coronavirus issues in their communities.

Image provided by: CDC/ Alissa Eckert, MS; Dan Higgins, MAM
Photoresist : materials and processes Preview this item
ClosePreview this item
Checking...

Photoresist : materials and processes

Author: William S DeForest
Publisher: New York : McGraw-Hill, [1975]
Edition/Format:   Print book : EnglishView all editions and formats
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Additional Physical Format: Online version:
DeForest, William S.
Photoresist.
New York : McGraw-Hill, [1975]
(OCoLC)602547400
Document Type: Book
All Authors / Contributors: William S DeForest
ISBN: 0070162301 9780070162303
OCLC Number: 1054407
Description: xi, 269 pages : illustrations ; 24 cm
Responsibility: W.S. DeForest.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity<\/h3>
<http:\/\/www.worldcat.org\/oclc\/1054407<\/a>> # Photoresist : materials and processes<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Book<\/a>, schema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0library:oclcnum<\/a> \"1054407<\/span>\" ;\u00A0\u00A0\u00A0library:placeOfPublication<\/a> <http:\/\/dbpedia.org\/resource\/New_York_City<\/a>> ; # New York<\/span>\u00A0\u00A0\u00A0library:placeOfPublication<\/a> <http:\/\/id.loc.gov\/vocabulary\/countries\/nyu<\/a>> ;\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/photowiderstand<\/a>> ; # Photowiderstand<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/id.worldcat.org\/fast\/1062099<\/a>> ; # Photoresists<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/elektronik<\/a>> ; # Elektronik<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/id.worldcat.org\/fast\/975535<\/a>> ; # Integrated circuits<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/dewey.info\/class\/621.38173\/<\/a>> ;\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/id.worldcat.org\/fast\/1076537<\/a>> ; # Printed circuits<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/makromolekul<\/a>> ; # Makromolek\u00FCl<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/organische_verbindungen<\/a>> ; # Organische Verbindungen<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/photoresist<\/a>> ; # Photoresist<\/span>\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/polymere<\/a>> ; # Polymere<\/span>\u00A0\u00A0\u00A0schema:bookFormat<\/a> bgn:PrintBook<\/a> ;\u00A0\u00A0\u00A0schema:creator<\/a> <http:\/\/viaf.org\/viaf\/311344424<\/a>> ; # William S. DeForest<\/span>\u00A0\u00A0\u00A0schema:datePublished<\/a> \"1975<\/span>\" ;\u00A0\u00A0\u00A0schema:exampleOfWork<\/a> <http:\/\/worldcat.org\/entity\/work\/id\/309221317<\/a>> ;\u00A0\u00A0\u00A0schema:inLanguage<\/a> \"en<\/span>\" ;\u00A0\u00A0\u00A0schema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/602547400<\/a>> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Photoresist : materials and processes<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0schema:productID<\/a> \"1054407<\/span>\" ;\u00A0\u00A0\u00A0schema:publication<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/1054407#PublicationEvent\/new_york_mcgraw_hill_1975<\/a>> ;\u00A0\u00A0\u00A0schema:publisher<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Agent\/mcgraw_hill<\/a>> ; # McGraw-Hill<\/span>\u00A0\u00A0\u00A0schema:workExample<\/a> <http:\/\/worldcat.org\/isbn\/9780070162303<\/a>> ;\u00A0\u00A0\u00A0wdrs:describedby<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/1054407<\/a>> ;\u00A0\u00A0\u00A0\u00A0.<\/div>

Related Entities<\/h3>
<http:\/\/dbpedia.org\/resource\/New_York_City<\/a>> # New York<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Place<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"New York<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/dewey.info\/class\/621.38173\/<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Agent\/mcgraw_hill<\/a>> # McGraw-Hill<\/span>\u00A0\u00A0\u00A0\u00A0a bgn:Agent<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"McGraw-Hill<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/elektronik<\/a>> # Elektronik<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Elektronik<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/makromolekul<\/a>> # Makromolek\u00FCl<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Makromolek\u00FCl<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/organische_verbindungen<\/a>> # Organische Verbindungen<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Organische Verbindungen<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/photoresist<\/a>> # Photoresist<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Photoresist<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/photowiderstand<\/a>> # Photowiderstand<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Photowiderstand<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/309221317#Topic\/polymere<\/a>> # Polymere<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Polymere<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.loc.gov\/vocabulary\/countries\/nyu<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:Place<\/a> ;\u00A0\u00A0\u00A0dcterms:identifier<\/a> \"nyu<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.worldcat.org\/fast\/1062099<\/a>> # Photoresists<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Photoresists<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.worldcat.org\/fast\/1076537<\/a>> # Printed circuits<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Printed circuits<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/id.worldcat.org\/fast\/975535<\/a>> # Integrated circuits<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Intangible<\/a> ;\u00A0\u00A0\u00A0schema:name<\/a> \"Integrated circuits<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/viaf.org\/viaf\/311344424<\/a>> # William S. DeForest<\/span>\u00A0\u00A0\u00A0\u00A0a schema:Person<\/a> ;\u00A0\u00A0\u00A0schema:familyName<\/a> \"DeForest<\/span>\" ;\u00A0\u00A0\u00A0schema:givenName<\/a> \"William S.<\/span>\" ;\u00A0\u00A0\u00A0schema:name<\/a> \"William S. DeForest<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/worldcat.org\/isbn\/9780070162303<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:ProductModel<\/a> ;\u00A0\u00A0\u00A0schema:isbn<\/a> \"0070162301<\/span>\" ;\u00A0\u00A0\u00A0schema:isbn<\/a> \"9780070162303<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/www.worldcat.org\/oclc\/602547400<\/a>>\u00A0\u00A0\u00A0\u00A0a schema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0rdfs:label<\/a> \"Photoresist.<\/span>\" ;\u00A0\u00A0\u00A0schema:description<\/a> \"Online version:<\/span>\" ;\u00A0\u00A0\u00A0schema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/1054407<\/a>> ; # Photoresist : materials and processes<\/span>\u00A0\u00A0\u00A0\u00A0.<\/div>
<http:\/\/www.worldcat.org\/title\/-\/oclc\/1054407<\/a>>\u00A0\u00A0\u00A0\u00A0a genont:InformationResource<\/a>, genont:ContentTypeGenericResource<\/a> ;\u00A0\u00A0\u00A0schema:about<\/a> <http:\/\/www.worldcat.org\/oclc\/1054407<\/a>> ; # Photoresist : materials and processes<\/span>\u00A0\u00A0\u00A0schema:dateModified<\/a> \"2018-11-10<\/span>\" ;\u00A0\u00A0\u00A0void:inDataset<\/a> <http:\/\/purl.oclc.org\/dataset\/WorldCat<\/a>> ;\u00A0\u00A0\u00A0\u00A0.<\/div>