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Physical architecture of VLSI systems

Author: Rob Hannemann; Allan D Kraus; Michael Pecht
Publisher: New York : Wiley, ©1994.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:
This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them. In this book, academic researchers, graduate students, and practicing mechanical, electrical, and materials engineers will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing  Read more...
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Additional Physical Format: Online version:
Physical architecture of VLSI systems.
New York : Wiley, ©1994
(OCoLC)624751187
Document Type: Book
All Authors / Contributors: Rob Hannemann; Allan D Kraus; Michael Pecht
ISBN: 0471532991 9780471532996
OCLC Number: 30109399
Notes: "A Wiley-Interscience publication."
Description: x, 887 pages : illustrations ; 25 cm
Contents: The Physical Architecture of Electronic Systems; Semiconductor Packaging; Interconnect Substrate Technologies; Electronic Module Technology; Interassembly and Intersystem Interconnect; Manufacturing Multichip Modules; Electronic Systems Topology and Design; Electrical Design of Packaging Systems; Thermal Design and Control; Vibration and Shock Analysis; Mechanical Design Methodologies in Electronic Packaging; Electronic Packaging Materials and Their Properties; Reliability Issues.
Responsibility: edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.

Abstract:

This examination of VLSI systems describes the interconnection of the microelectronic components, engineering requirements, and mechanical, electrical and materials factors that must be considered in  Read more...

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