Printed circuits handbook (eBook, 2016) [WorldCat.org]
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Printed circuits handbook
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Printed circuits handbook

Author: Clyde F Coombs; Happy T Holden
Publisher: New York : McGraw-Hill Education, [2016]
Edition/Format:   eBook : Document : English : Seventh editionView all editions and formats
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Genre/Form: Electronic books
Handbooks and manuals
Handbooks, manuals, etc
Guides, manuels, etc
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Clyde F Coombs; Happy T Holden
ISBN: 9780071833950 0071833951
OCLC Number: 1053694740
Notes: "50th anniversary edition!"
Description: 1 online resource
Contents: Cover --
Title Page --
Copyright Page --
Contents --
Contributors --
Preface --
Part 1 Printed Circuit Technology Drivers --
Chapter 1. Electronic Packaging and High-Density Interconnectivity --
Chapter 2. Types of Printed Wiring Boards --
Part 2 Managing the Printed Circuit Supply Chain --
Chapter 3. Basics of Printed Circuit Supply Chain Management --
Chapter 4. Design for Manufacturability --
Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange --
Chapter 6. Supplier Selection and Qualification --
Chapter 7. Process Control, Monitoring, and Incoming Inspection --
Chapter 8. Product Acceptance and Feedback --
Part 3 Materials --
Chapter 9. Introduction to Base Materials --
Chapter 10. Base Material Components --
Chapter 11. Properties of Base Materials --
Chapter 12. Base Material Performance in PCBs --
Chapter 13. The Impact of Lead-Free Assembly on Base Materials --
Chapter 14. Selecting Base Materials --
Chapter 15. Laminate Qualification and Testing --
Part 4 Engineering and Design --
Chapter 16. Planning for Design, Fabrication, and Assembly --
Chapter 17. Physical Characteristics of the PCB --
Chapter 18. Electronic Design Automation and Printed Circuit Design Tools --
Chapter 19. The PCB Design Process --
Chapter 20. Electrical and Mechanical Design Parameters --
Chapter 21. The Basics of Printed Circuit Board Design --
Chapter 22. Current Carrying Capacity in Printed Circuits --
Chapter 23. PCB Design for Thermal Performance --
Chapter 24. Embedded Components --
Part 5 High- Density Interconnection --
Chapter 25. Introduction to High-Density Interconnection Technology --
Chapter 26. Advanced High-Density Interconnection Technologies --
Part 6 Fabrication --
Chapter 27. CAM Tooling for Fab and Assembly --
Chapter 28. Drilling Processes --
Chapter 29. Precision Interconnect and Laser Drilling --
Chapter 30. Imaging and Automated Optical Inspection --
Chapter 31. Multilayer Materials and Processing --
Chapter 32. Preparing Boards for Plating --
Chapter 33. Electroplating --
Chapter 34. Direct Plating --
Chapter 35. Printed Circuit Board Surface Finishes --
Chapter 36. Solder Mask --
Chapter 37. Etching Process and Technologies --
Chapter 38. Routing and V-Scoring --
Part 7 Bare Board Test --
Chapter 39. Bare Board Test Objectives and Definitions --
Chapter 40. Bare Board Test Methods --
Chapter 41. Bare Board Test Equipment --
Chapter 42. HDI Bare Board Special Testing Methods --
Part 8 Assembly, Soldering Materials, and Processes --
Chapter 43. Assembly Processes --
Chapter 44. Conformal Coating --
Chapter 45. Fluxes and Cleaning --
Chapter 46. Soldering Fundamentals --
Chapter 47. Soldering Materials and Metallurgy --
Chapter 48. Solder Fluxes --
Chapter 49. Soldering Techniques --
Chapter 50. Soldering Repair and Rework --
Part 9 Nonsolder Interconnection --
Chapter 51. Press-Fit Interconnection --
Chapter 52. Pressure-Interconnect Land Grid Array Systems --
Part 10 Quality --
Chapter 53. Acceptability and Quality of Fabricated Boards --
Chapter 54. Acceptability of Printed Circuit Board Assemblies --
Chapter 55. Assembly Inspection --
Chapter 56. Design for Testing --
Chapter 57. Loaded Board Testing --
Chapter 58. Failure Modes and Effects Analysis --
Part 11 Reliability --
Chapter 59. Conductive Anodic Filament Formation --
Chapter 60. Reliability of Printed Circuit Boards --
Chapter 61. Reliability of Microvia Printed Circuit Boards --
Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free --
Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules --
Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders --
Part 12 Flexible Circuits --
Chapter 65. Flexible Circuit Applications and Materials --
Chapter 66. Design of Flexible Circuits --
Chapter 67. Manufacturing Flexible Circuits --
Chapter 68. Termination Options for Flexible Circuits --
Chapter 69. Multilayer Flex and Rigid Flex --
Chapter 70. Special Constructions of Flexible Circuits --
Chapter 71. Flexible Circuit Quality Assurance: Principles and Practices --
Appendix. Summary of Key Component, Material, Process, and Design Standards --
Glossary --
A --
B --
C --
D --
E --
F --
G --
H --
I --
J --
K --
L --
M --
N --
O --
P --
Q --
R --
S --
T --
U --
V --
W --
Index --
A --
B --
C --
D --
E --
F --
G --
H --
I --
J --
K --
L --
M --
N --
O --
P --
Q --
R --
S --
T --
V --
W.
Responsibility: Clyde F. Coombs, Jr., co-editor-in-chief, Happy T. Holden, co-editor-in-chief.

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