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Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality

Author: James C Rainwater; National Institute of Standards and Technology (U.S.); United States. Department of Commerce. Technology Administration.
Publisher: [Boulder, Colo.] : NIST : U.S. Dept. of Commerce, Technology Administration, 2001.
Series: NIST special publication, 975.
Edition/Format:   Print book : National government publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Report on Forum 2000
viii, 116 p.
(OCoLC)50263176
Online version:
Report on Forum 2000.
[Boulder, Colo.] : NIST : U.S. Dept. of Commerce, Technology Administration, 2001
(OCoLC)647461198
Material Type: Government publication, National government publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: James C Rainwater; National Institute of Standards and Technology (U.S.); United States. Department of Commerce. Technology Administration.
OCLC Number: 48888558
Notes: Forum 2000 was held June 29, 2000, at the Fourteenth Symposium on Thermophysical Properties in Boulder, Colorado.
"September 2001."
Description: viii, 116 pages : illustrations ; 28 cm + 1 computer optical disc.
Details: Mode of access: World Wide Web: http://forum2000.boulder.nist.gov/NISTSP975.pdf.
Series Title: NIST special publication, 975.
Other Titles: Fluid properties for new technologies : connecting virtual design with physical reality
Connecting virtual design with physical reality
Fluid properties for new technologies : connecting virtual design with physical reality : a strategic forum during the 14th Symposium on Thermophysical Properties
Responsibility: James C. Rainwater [and others].

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\n\n

Primary Entity<\/h3>\n
<http:\/\/www.worldcat.org\/oclc\/48888558<\/a>> # Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:CreativeWork<\/a>, schema:Book<\/a> ;\u00A0\u00A0\u00A0\nlibrary:oclcnum<\/a> \"48888558<\/span>\" ;\u00A0\u00A0\u00A0\nlibrary:placeOfPublication<\/a> <http:\/\/id.loc.gov\/vocabulary\/countries\/cou<\/a>> ;\u00A0\u00A0\u00A0\nlibrary:placeOfPublication<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Place\/boulder_colo<\/a>> ; # Boulder, Colo.<\/span>\n\u00A0\u00A0\u00A0\nschema:about<\/a> <http:\/\/id.worldcat.org\/fast\/927999<\/a>> ; # Fluid mechanics<\/span>\n\u00A0\u00A0\u00A0\nschema:about<\/a> <http:\/\/id.worldcat.org\/fast\/1011896<\/a>> ; # Materials--Thermal properties<\/span>\n\u00A0\u00A0\u00A0\nschema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Topic\/fluid_mechanics<\/a>> ; # Fluid mechanics<\/span>\n\u00A0\u00A0\u00A0\nschema:about<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Topic\/materials_thermal_properties<\/a>> ; # Materials--Thermal properties<\/span>\n\u00A0\u00A0\u00A0\nschema:alternateName<\/a> \"Connecting virtual design with physical reality<\/span>\" ;\u00A0\u00A0\u00A0\nschema:alternateName<\/a> \"Fluid properties for new technologies : connecting virtual design with physical reality<\/span>\" ;\u00A0\u00A0\u00A0\nschema:alternateName<\/a> \"Fluid properties for new technologies : connecting virtual design with physical reality : a strategic forum during the 14th Symposium on Thermophysical Properties<\/span>\" ;\u00A0\u00A0\u00A0\nschema:bookFormat<\/a> bgn:PrintBook<\/a> ;\u00A0\u00A0\u00A0\nschema:contributor<\/a> <http:\/\/viaf.org\/viaf\/176148996084059752834<\/a>> ; # James C. Rainwater<\/span>\n\u00A0\u00A0\u00A0\nschema:contributor<\/a> <http:\/\/viaf.org\/viaf\/133379358<\/a>> ; # United States. Department of Commerce. Technology Administration.<\/span>\n\u00A0\u00A0\u00A0\nschema:contributor<\/a> <http:\/\/viaf.org\/viaf\/131110795<\/a>> ; # National Institute of Standards and Technology (U.S.)<\/span>\n\u00A0\u00A0\u00A0\nschema:contributor<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Meeting\/symposium_on_thermophysical_properties_14th_2000_university_of_colorado<\/a>> ; # Symposium on Thermophysical Properties (14th : 2000 : University of Colorado)<\/span>\n\u00A0\u00A0\u00A0\nschema:datePublished<\/a> \"2001<\/span>\" ;\u00A0\u00A0\u00A0\nschema:exampleOfWork<\/a> <http:\/\/worldcat.org\/entity\/work\/id\/497550505<\/a>> ;\u00A0\u00A0\u00A0\nschema:genre<\/a> \"National government publication<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\nschema:genre<\/a> \"Conference papers and proceedings<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\nschema:genre<\/a> \"Government publication<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\nschema:inLanguage<\/a> \"en<\/span>\" ;\u00A0\u00A0\u00A0\nschema:isPartOf<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Series\/nist_special_publication<\/a>> ; # NIST special publication ;<\/span>\n\u00A0\u00A0\u00A0\nschema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/647461198<\/a>> ;\u00A0\u00A0\u00A0\nschema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/50263176<\/a>> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\nschema:productID<\/a> \"48888558<\/span>\" ;\u00A0\u00A0\u00A0\nschema:publication<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/48888558#PublicationEvent\/boulder_colo_nist_u_s_dept_of_commerce_technology_administration_2001<\/a>> ;\u00A0\u00A0\u00A0\nschema:publisher<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/nist<\/a>> ; # NIST<\/span>\n\u00A0\u00A0\u00A0\nschema:publisher<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/u_s_dept_of_commerce_technology_administration<\/a>> ; # U.S. Dept. of Commerce, Technology Administration<\/span>\n\u00A0\u00A0\u00A0\nschema:url<\/a> <http:\/\/forum2000.boulder.nist.gov\/<\/a>> ;\u00A0\u00A0\u00A0\nschema:url<\/a> <http:\/\/forum2000.boulder.nist.gov\/NISTSP975.pdf<\/a>> ;\u00A0\u00A0\u00A0\nwdrs:describedby<\/a> <http:\/\/www.worldcat.org\/title\/-\/oclc\/48888558<\/a>> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n\n

Related Entities<\/h3>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/nist<\/a>> # NIST<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nbgn:Agent<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"NIST<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/u_s_dept_of_commerce_technology_administration<\/a>> # U.S. Dept. of Commerce, Technology Administration<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nbgn:Agent<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"U.S. Dept. of Commerce, Technology Administration<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Meeting\/symposium_on_thermophysical_properties_14th_2000_university_of_colorado<\/a>> # Symposium on Thermophysical Properties (14th : 2000 : University of Colorado)<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nbgn:Meeting<\/a>, schema:Event<\/a> ;\u00A0\u00A0\u00A0\nschema:location<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Place\/university_of_colorado<\/a>> ; # University of Colorado)<\/span>\n\u00A0\u00A0\u00A0\nschema:name<\/a> \"Symposium on Thermophysical Properties (14th : 2000 : University of Colorado)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Place\/boulder_colo<\/a>> # Boulder, Colo.<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Place<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Boulder, Colo.<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Place\/university_of_colorado<\/a>> # University of Colorado)<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Place<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"University of Colorado)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Series\/nist_special_publication<\/a>> # NIST special publication ;<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nbgn:PublicationSeries<\/a> ;\u00A0\u00A0\u00A0\nschema:hasPart<\/a> <http:\/\/www.worldcat.org\/oclc\/48888558<\/a>> ; # Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\n\u00A0\u00A0\u00A0\nschema:name<\/a> \"NIST special publication ;<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Topic\/fluid_mechanics<\/a>> # Fluid mechanics<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Intangible<\/a> ;\u00A0\u00A0\u00A0\nrdfs:seeAlso<\/a> <http:\/\/id.loc.gov\/authorities\/subjects\/sh2008103863<\/a>> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Fluid mechanics<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Topic\/materials_thermal_properties<\/a>> # Materials--Thermal properties<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Intangible<\/a> ;\u00A0\u00A0\u00A0\nrdfs:seeAlso<\/a> <http:\/\/id.loc.gov\/authorities\/subjects\/sh2010100984<\/a>> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Materials--Thermal properties<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/forum2000.boulder.nist.gov\/<\/a>>\u00A0\u00A0\u00A0\nrdfs:comment<\/a> \"Go to Forum 2000 [conference website]<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/forum2000.boulder.nist.gov\/NISTSP975.pdf<\/a>>\u00A0\u00A0\u00A0\nrdfs:comment<\/a> \"Go to Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality [electronic book]<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/id.loc.gov\/vocabulary\/countries\/cou<\/a>>\u00A0\u00A0\u00A0\u00A0a \nschema:Place<\/a> ;\u00A0\u00A0\u00A0\ndcterms:identifier<\/a> \"cou<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/id.worldcat.org\/fast\/1011896<\/a>> # Materials--Thermal properties<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Intangible<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Materials--Thermal properties<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/id.worldcat.org\/fast\/927999<\/a>> # Fluid mechanics<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Intangible<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"Fluid mechanics<\/span>\"@en<\/a> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/viaf.org\/viaf\/131110795<\/a>> # National Institute of Standards and Technology (U.S.)<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Organization<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"National Institute of Standards and Technology (U.S.)<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/viaf.org\/viaf\/133379358<\/a>> # United States. Department of Commerce. Technology Administration.<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Organization<\/a> ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"United States. Department of Commerce. Technology Administration.<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/viaf.org\/viaf\/176148996084059752834<\/a>> # James C. Rainwater<\/span>\n\u00A0\u00A0\u00A0\u00A0a \nschema:Person<\/a> ;\u00A0\u00A0\u00A0\nschema:familyName<\/a> \"Rainwater<\/span>\" ;\u00A0\u00A0\u00A0\nschema:givenName<\/a> \"James C.<\/span>\" ;\u00A0\u00A0\u00A0\nschema:name<\/a> \"James C. Rainwater<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/www.worldcat.org\/oclc\/50263176<\/a>>\u00A0\u00A0\u00A0\u00A0a \nschema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0\nrdfs:label<\/a> \"Report on Forum 2000<\/span>\" ;\u00A0\u00A0\u00A0\nschema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/48888558<\/a>> ; # Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\n\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/www.worldcat.org\/oclc\/647461198<\/a>>\u00A0\u00A0\u00A0\u00A0a \nschema:CreativeWork<\/a> ;\u00A0\u00A0\u00A0\nrdfs:label<\/a> \"Report on Forum 2000.<\/span>\" ;\u00A0\u00A0\u00A0\nschema:description<\/a> \"Online version:<\/span>\" ;\u00A0\u00A0\u00A0\nschema:isSimilarTo<\/a> <http:\/\/www.worldcat.org\/oclc\/48888558<\/a>> ; # Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\n\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/www.worldcat.org\/title\/-\/oclc\/48888558<\/a>>\u00A0\u00A0\u00A0\u00A0a \ngenont:InformationResource<\/a>, genont:ContentTypeGenericResource<\/a> ;\u00A0\u00A0\u00A0\nschema:about<\/a> <http:\/\/www.worldcat.org\/oclc\/48888558<\/a>> ; # Report on Forum 2000 : fluid properties for new technologies : connecting virtual design with physical reality<\/span>\n\u00A0\u00A0\u00A0\nschema:dateModified<\/a> \"2019-03-13<\/span>\" ;\u00A0\u00A0\u00A0\nvoid:inDataset<\/a> <http:\/\/purl.oclc.org\/dataset\/WorldCat<\/a>> ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n
<http:\/\/www.worldcat.org\/title\/-\/oclc\/48888558#PublicationEvent\/boulder_colo_nist_u_s_dept_of_commerce_technology_administration_2001<\/a>>\u00A0\u00A0\u00A0\u00A0a \nschema:PublicationEvent<\/a> ;\u00A0\u00A0\u00A0\nschema:location<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Place\/boulder_colo<\/a>> ; # Boulder, Colo.<\/span>\n\u00A0\u00A0\u00A0\nschema:organizer<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/u_s_dept_of_commerce_technology_administration<\/a>> ; # U.S. Dept. of Commerce, Technology Administration<\/span>\n\u00A0\u00A0\u00A0\nschema:organizer<\/a> <http:\/\/experiment.worldcat.org\/entity\/work\/data\/497550505#Agent\/nist<\/a>> ; # NIST<\/span>\n\u00A0\u00A0\u00A0\nschema:startDate<\/a> \"2001<\/span>\" ;\u00A0\u00A0\u00A0\u00A0.\n\n\n<\/div>\n\n

Content-negotiable representations<\/p>\n