Semiconductor machining at the micro-nano scale (Book, 2007) [WorldCat.org]
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Semiconductor machining at the micro-nano scale

Publisher: Kerala, India : Transworld Research Network, 2007.
Edition/Format:   Print book : EnglishView all editions and formats
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Document Type: Book
ISBN: 9788178953014 8178953013
OCLC Number: 297520606
Description: 360 pages : illustrations (some color), charts ; 22 cm
Contents: Part 1/ SINGLE- POINT MACHINING PROCESSES: Surface and subsurface integrity in ductile machining of semiconductor materials/ Jiwang Yan --
Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics / John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh --
Ductile machining and high pressure phase transformations of semiconductor crystals / Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sergio Pizani. Part 2/ CHARACTERIZATION OF DEFORMATION MECHANISMS: Microstructural cahnges in silicon caused by indentation and machining / L.C. Zhang --
MD simulation of semiconductor micromachining / Hiroaki Tanaka and Shoichi Shimada. Part 3/ ABRASIVE MACHINING PROCESSES: Grinding of silicon wafers in the nano-technology era / Z.J. Pei, Z.C. Li and G.R. Fisher --
Single-crystalline and poly-crystalline silicon wafer production using slurry wire for wafer slicing with micro-and nano-scale rolling-indenting / Sumeet Bhagavat and Imin Kao --
Tribo-metrology of CMP / Norm V. Gitts. Part 4/ HYBRID AND LASER MACHINING: Semiconductor nanofabrication by combining nanoscale machining with wet etching / Noboiru Morita and Noritaka Kawasegi --
Laser machining of semiconductor devices / Maher S. Amer.
Responsibility: edited by Jiwang Yan and John Patten.

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