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Thin Film Processes.

Author: John L Vossen
Publisher: Saint Louis : Elsevier Science, 2014.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Vossen, John L.
Thin Film Processes.
Saint Louis : Elsevier Science, ©2014
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: John L Vossen
ISBN: 9780323138987 0323138985
OCLC Number: 1044714090
Notes: IV. Tables of Etchants and Etching Conditions.
Description: 1 online resource (577 pages)
Contents: Front Cover; Thin Film Processes; Copyright Page; Table of Contents; Preface; Part I:; Chapter I-1. Introduction; I. The Organization of this Book; II. Other Film Deposition Processes; References; Part II: Physical Methods of Film Deposition; Chapter II-1. Glow Discharge Sputter Deposition; I. Introduction; II. Physical and Chemical Effects of Ion Bombardment on Surfaces; III. Glow Discharges; IV. Equipment Configuration; V. Preconditioning of Targets, Substrates, and Systems for Film Deposition; VI. The Sputtering Gas. VII. Deposition with Simultaneous Ion Bombardment of the Substrate and Growing FilmVIII. Rate and Uniformity of Deposition; IX. Conclusion; References ; Chapter II-2. Cylindrical Magnetron Sputtering; I. Introduction ; II. Principles of Operation; III. Cylindrical Magnetron Apparatus; IV. Plasma Discharge; V. RF Operation; VI. Erosion and Deposition Profiles; VII . Coating Deposition; VIII. Reactive Sputtering; IX. Summary; References; Chapter II-3. The Sputter and S-Gun Magnetrons; I. Introduction; II. Description; III. Operational Characteristics; IV. Bias Operation; V. Film Deposition. VI . ConclusionsAcknowledgments; References; Chapter II -4. Planar Magnetron Sputtering; I. Introduction; II. DC Planar Magnetron Sputtering; III. RF Planar Magnetron Sputtering; IV. Applications; V. Conclusions; References; Chapter II -5. Ion Beam Deposition; I. Introduction; II. Ion Beam Generation; III. Secondary Ion Beam Deposition; IV. Primary Ion Beam Deposition; V. Concluding Comments; Acknowledgments; References; Part III: Chemical Methods of Film Deposition; Chapter III -1. Deposition of Inorganic Films from Solution; I. Introduction; II. Deposition by Chemical Reactions. III. Deposition by Electrochemical ReactionsIV. Conclusion; Acknowledgment; References; Chapter III-2. Chemical Vapor Deposition of Inorganic Thin Films; I. Introduction; II. Fundamental Aspects of CVD; III. CVD Reactor Systems; IV. CVD of Insulators; V. CVD of Semiconductors; VI. CVD of Conductors; VII. CVD of Miscellaneous Materials; VIII. Conclusions; Acknowledgments; References; Part IV: Physical-chemical Methods of Film Deposition; Chapter IV-1. Plasma Deposition of Inorganic Thin Films; I. Introduction; II. Experimental Requirements and Techniques. III. Deposition of Thin Inorganic FilmsIV. Conclusions, Applications, and Prospects; References; Chapter IV-2. Glow Discharge Polymerization; I. Introduction; II. Characteristic Aspects of Glow Discharge Polymerization; III. Processing Factors of Glow Discharge Polymerization; IV. Organic Compounds for Glow Discharge Polymerization; V. Dependence of Glow Discharge Polymerization on Processing Factors; References; Part V: Etching Processes; Chapter V-1. Chemical Etching; I. Introduction; II. Principles and Techniques of Etching; III. Chemical Etching of Specific Materials.

Abstract:

Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process.

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