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Wafer Level Packaging Conference (IWLPC), International

Publisher: [S.l.] : [s.n.]
Edition/Format:   eJournal/eMagazine : Document
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Genre/Form: Electronic journals
Periodicals
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File, Journal / Magazine / Newspaper
OCLC Number: 1084338375
Notes: Title from content provider.
Other Titles: Wafer Level Packaging Conference (IWLPC), International (Online)

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Primary Entity

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    schema:exampleOfWork <http://worldcat.org/entity/work/id/8897375416> ; # Wafer Level Packaging Conference (IWLPC), International (Online)
    schema:genre "Electronic journals" ;
    schema:genre "Periodicals" ;
    schema:name "Wafer Level Packaging Conference (IWLPC), International" ;
    schema:productID "1084338375" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/1084338375#PublicationEvent/s_l_s_n> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/8897375416#Agent/s_n> ; # [s.n.
    schema:url <https://ieeexplore.ieee.org/servlet/opac?punumber=1828904> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/1084338375> ;
    .


Related Entities

<http://worldcat.org/entity/work/id/8897375416> # Wafer Level Packaging Conference (IWLPC), International (Online)
    schema:name "Wafer Level Packaging Conference (IWLPC), International (Online)" ;
    .


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